Modular Display Interconnection Using Conductive Bonding Layers
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Solution Overview
Problem
Large display devices with high resolution and color purity are challenging to manufacture due to complex processes and issues with color uniformity and visible black lines at connection points, especially for outdoor billboards requiring large sizes and high resolution.
Innovation Solution
A display device design featuring multiple light emitting modules with signal and common lines, a motherboard, and a bonding layer for electrical conductivity, using anisotropic conductive films or pastes for connection, along with a method of manufacturing that includes testing light emitting diodes and cutting base substrates to form modules, facilitating easy connection and color consistency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple light emitting modules are connected using traditional wire bonding and solder mount methods, then electrical connection is achieved, but visible black lines appear at connection points and manufacturing complexity increases
Solution Approach 1:
The patent introduces a bonding layer as an intermediary substance between the light emitting modules and the printed circuit board. This bonding layer replaces traditional wire bonding and solder mount methods, providing electrical connection while eliminating the visible black lines that appear at connection points in conventional approaches.
Solution Approach 2:
The patent replaces the mechanical wire bonding and solder mount systems with a bonding layer-based electrical connection system. This substitution eliminates the need for physical wires and solder joints, thereby removing the source of visible black lines while maintaining electrical connectivity.
2Productivity
If traditional manufacturing processes are used for large display devices, then production is possible, but manufacturing time is long and color uniformity is difficult to achieve
Solution Approach 1:
The patent divides the display device into multiple light emitting modules that can be manufactured independently and then assembled. This segmentation allows for parallel manufacturing processes, reducing overall manufacturing time while ensuring each module meets color uniformity standards before assembly.
Solution Approach 2:
The patent implements preliminary testing of light emitting diodes and pre-arrangement of modules on the printed circuit board before final assembly. This preliminary action ensures that color uniformity is verified early in the process, allowing for corrections before final assembly and reducing rework time.
3Ease of manufacture
If light emitting modules are installed with standard tolerances, then installation is feasible, but black lines become visible at connection points
Solution Approach 1:
The bonding layer serves as an intermediary that compensates for installation tolerances. It fills the gaps between light emitting modules and the printed circuit board, ensuring electrical connection while preventing visible black lines even when standard installation tolerances are present.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies the manufacturing process, ensures high color purity and reproducibility, and eliminates visible black lines, enabling efficient production of large, high-resolution display devices with improved color uniformity.
Implementation Method 1
a bonding layer having electrical conductivity and coupling the multiple light emitting modules to the motherboard
Implementation Method 2
using anisotropic conductive films or pastes for connection
Data Source
AI summary
A display device comprising a first base substrate, a second base substrate having a different area than the first base substrate, a plurality of pixels disposed on each of the first and second base substrates, and an interconnection part connected to the pixels, the interconnection part including a plurality of signal interconnections disposed on each of the first and second base substrates, in which the signal interconnections disposed on the first base substrate are connected to the signal interconnections disposed on the second base substrate through a plurality of connecting portions disposed on both of the first and second base substrates.