Modular Driving Chip PCB for Display Panel Signal Integrity
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Solution Overview
Problem
Current display devices face challenges in reducing component complexity and processing time while achieving high-resolution and high-speed performance.
Innovation Solution
The display device incorporates a printed circuit board with a base board, first and second driving chip modules, and a connector, where the second driving chip module includes modularized driving chips, an image data input unit, a power supply unit, and a timing controller, connected through conductive layers and insulation layers to facilitate efficient signal transmission and reduce component count.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If multiple separate driving chips and controllers are used, then functional completeness is achieved, but device complexity increases
Solution Approach 1:
The patent combines multiple driving chips (first driving chip, second driving chip, third driving chip) and control units into a single integrated printed circuit board assembly. The driving chips are mounted on the same substrate with interconnected signal lines, eliminating the need for separate modules and reducing overall device complexity while maintaining complete driving functionality.
Solution Approach 2:
The printed circuit board is designed as a universal platform that hosts multiple driving chips and control units, each performing specialized functions (scan driving, emission driving, data driving). This multi-functional integration allows a single module to replace multiple separate components, simplifying the overall structure.
2Loss of time
If traditional attachment methods (connector or ACF) are used, then electrical connection is achieved, but processing time increases
Solution Approach 1:
The driving chips are pre-mounted and electrically connected to the display panel during the panel manufacturing process itself, before final assembly. This preliminary integration eliminates subsequent attachment steps requiring connectors or ACF, significantly reducing overall processing time while maintaining manufacturing feasibility through standardized chip mounting procedures.
3Speed
If signal transmission paths are extended, then functional connectivity is achieved, but signal transmission delay increases
Solution Approach 1:
The signal transmission path is segmented into dedicated short routes for each driving chip type. Scan driving signals follow one optimized path, emission driving signals follow another, and data signals have separate routing. This segmentation minimizes total path length for each signal type while maintaining functional connectivity, reducing transmission delays.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration simplifies the module structure, reduces processing time, and enables ultra-high resolution processing at ultra-high speeds by minimizing signal transmission delays and distortions, resulting in a high-speed and high-resolution display device.
Implementation Method 1
can be attached to the flexible film through an anisotropic conductive film (ACF) with the anisotropic conductive film interposed between the flexible film and the printed circuit board
Implementation Method 2
the first driving chip module may be electrically connected to the conductive layer through the bumps
Data Source
AI summary
A display device including a display panel and a printed circuit board attached to one end portion of the display panel. The printed circuit board includes a base board, a first driving chip module disposed on the base board, and a second driving chip module spaced apart from the first driving chip module. The first driving chip module includes a timing controller and a data driver, and the second driving chip module includes a plurality of modularized driving chips.