Modular Embedded Development Platform for Compact Prototyping
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Solution Overview
Problem
Developing representative prototypes for consumer computing devices is time-consuming and expensive due to the need for multiple iterations and the production of large, unwieldy prototypes that do not accurately reflect the final product, leading to ineffective user trials.
Innovation Solution
A modular development platform consisting of a base module with a processor and peripheral modules that can be electrically and physically connected, enabling the creation of compact, robust, and power-efficient prototypes for user trials and small-scale production, with a well-defined interface allowing for easy development and management of additional peripheral modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If large, unwieldy prototypes are used in user trials, then the prototypes can be representative of the final product in terms of size and weight, but the users are unable to see beyond the shortcomings and do not use the devices in a realistic manner, leading to meaningless data
Solution Approach 1:
The device is divided into a base module and interchangeable peripheral modules. This segmentation allows the core functionality to be tested in a compact form while peripheral features can be added or modified without redesigning the entire device, enabling realistic user trials with manageable prototypes.
Solution Approach 2:
The modular architecture creates a simplified copy of the final product that captures essential functionality. The base module represents the core device, and peripheral modules replicate additional features, allowing users to interact with a realistic yet manageable representation of the final product.
2Manufacturing precision
If representative prototypes are developed by performing the same steps as creating the actual product (designing PCB, having it made, assembling), then the prototypes are sufficiently representative, but this leads to large upfront costs and is very time-consuming and expensive to iterate because PCB re-spins will almost certainly be required
Solution Approach 1:
By segmenting the device into a base module and separate peripheral modules, the invention eliminates the need for complete PCB re-spins during iteration. Developers can modify or swap peripheral modules without affecting the core base module, dramatically reducing iteration time and cost while maintaining prototype representativeness.
Solution Approach 2:
The base module is designed and finalized in advance with stable core functionality. This preliminary action allows subsequent iterations to focus only on peripheral modules, preventing the need for repeated full-device PCB re-spins and reducing overall development time.
3Loss of information
If multiple iterations of prototypes are required for user trials, then valuable feedback can be obtained to assess device value and determine further development, but the production of prototype devices is time consuming and expensive, particularly because several iterations are likely to be required
Solution Approach 1:
The modular architecture enables rapid iteration by allowing independent modification of peripheral modules. This segmentation facilitates multiple quick iterations to gather user feedback without the time and expense of producing entirely new prototypes for each iteration cycle.
Solution Approach 2:
Peripheral modules that do not meet user feedback requirements can be discarded and replaced with modified versions without wasting the base module. This allows efficient iteration where only the necessary components are redone, reducing overall production time and cost across multiple feedback-driven iterations.
Data Source
AI summary
A modular development platform is described which enables creation of reliable, compact, physically robust and power efficient embedded device prototypes. The platform consists of a base module which holds a processor and one or more peripheral modules each having an interface element. The base module and the peripheral modules may be electrically and/or physically connected together. The base module communicates with peripheral modules using packets of data with an addressing portion which identifies the peripheral module that is the intended recipient of the data packet.