Modular Fingerprint Recognition Package with Integrated Light Source
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Solution Overview
Problem
The manufacturing process of optical fingerprint sensors in a package or module form is complex and faces challenges in miniaturization and thinning due to the inclusion of a separate light source and image sensor die, making it difficult to simplify the process and reduce product thickness.
Innovation Solution
A fingerprint recognition package is designed without a separate light source, featuring a circuit board with an image sensor die, a light-shielding member applied to the circuit board, and an adhesive member attached to the light-shielding member, allowing for direct mounting of the image sensor die on the circuit board and sealing of its periphery, which simplifies the manufacturing process and enables miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an optical fingerprint sensor is manufactured in a package form including a package substrate, light source, and image sensor die, then the sensor can be assembled, but the manufacturing process becomes complex and miniaturization is difficult
Solution Approach 1:
The patent merges the light source and image sensor die into a single integrated sensor die structure. The light source is formed within the same semiconductor substrate as the image sensor, eliminating the need for separate light source components and package substrates. This integration directly reduces manufacturing complexity and enables miniaturization while maintaining the optical fingerprint sensing function.
2Length of moving object
If a separate light source is included in the package, then the optical fingerprint sensor can function, but the product thickness increases and miniaturization is hindered
Solution Approach 1:
The light source and image sensor die are merged into a single integrated structure where the light source is formed within the semiconductor substrate. This eliminates the need for separate light source components and reduces the overall package thickness, enabling miniaturization while maintaining optical fingerprint sensing capability.
Solution Approach 2:
The patent transitions from a three-dimensional stacked package structure to a planar integrated structure where the light source and image sensor are formed in the same substrate plane. This dimensional reorganization reduces the vertical thickness of the device while maintaining all necessary functional components.
3Ease of manufacture
If multiple components are assembled in a package, then the sensor can be manufactured, but the manufacturing process becomes difficult to simplify
Solution Approach 1:
The patent combines multiple discrete components (light source, image sensor die, package substrate) into a single integrated sensor die. This merger eliminates complex assembly processes and enables simpler, more efficient manufacturing through standard semiconductor fabrication techniques, thereby improving both manufacturing simplicity and productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the manufacturing process, reduces product thickness, and facilitates miniaturization by eliminating the need for a separate light source and allowing for direct mounting and sealing of the image sensor die, enhancing control over the package's dimensions and reducing the width of the image sensor die's flat face.
Implementation Method 1
a light-shielding member applied to the circuit board
Implementation Method 2
an adhesive member attached to one side of the light-shielding member
Data Source
AI summary
A fingerprint recognition package may include a circuit board; an image sensor die attached and electrically connected to the circuit board; a light-shielding member applied to the circuit board; and an adhesive member attached to one side of the light-shielding member. The light-shielding member can be cured by being irradiated with ultraviolet rays, and can be thermoset by being irradiated with heat.