Modular Functional Testing Platform for Parallel Device Testing

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Solution Overview

Problem

Current server motherboard and peripheral function card testing requires a real motherboard for each test, leading to high testing time and cost, making it impossible to balance supply and demand.

Innovation Solution

A functional testing device with a substrate, input/output module, functional testing modules, baseboard management control module, and power module that allows simultaneous testing of multiple devices without the need for a physical motherboard, using a test script to control testing signals and power distribution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a real motherboard is used for testing one device at a time, then testing accuracy is ensured, but testing time and cost increase significantly

Engineering Contradiction:
Improvetesting accuracyVSAvoidtesting time
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The patent segments the motherboard testing function into multiple independent functional modules (power module, CPU module, memory module, I/O module, etc.) that can be independently configured and connected to multiple DUTs simultaneously. Each module can be plugged into the substrate in different combinations to create multiple testing channels, enabling parallel testing while maintaining accuracy through dedicated functional components for each channel.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The substrate is designed with universal interfaces and standardized connection protocols that allow the same functional modules to be reused across multiple testing channels. The BMC module provides centralized control that can manage multiple DUTs through a single platform, making the testing system universally applicable to different device types while reducing the need for multiple dedicated motherboards.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If a real motherboard is used for testing, then complete system integration is achieved, but device complexity and cost increase

Engineering Contradiction:
Improvesystem integrationVSAvoidmotherboard complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent divides the integrated motherboard system into separate functional modules (power supply, CPU interface, memory interface, I/O interfaces, etc.) that can be independently designed, tested, and configured. These modules connect to the DUT through standardized interfaces on the substrate, achieving system integration without requiring a complete physical motherboard for each test channel.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The substrate acts as an intermediary platform between the functional modules and the DUTs. It provides standardized connection interfaces and signal routing that enable complete system integration testing without requiring the complexity of a full motherboard. The BMC module serves as another intermediary, providing centralized control and coordination across multiple testing channels.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Productivity

If multiple devices are tested simultaneously using separate motherboards, then testing throughput increases, but cost and resource requirements increase

Engineering Contradiction:
Improvetesting throughputVSAvoidresource requirements
Core Design Contradiction:
ProductivityVSQuantity of substance

Solution Approach 1:

The patent merges multiple testing functions and multiple DUT interfaces onto a single substrate platform. Multiple functional modules are pluggably connected to the same substrate, allowing simultaneous testing of multiple devices through shared resources (power supply, control logic, measurement equipment) while maintaining independent testing channels for each DUT.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The substrate is designed with universal interfaces and standardized protocols that enable a single platform to handle multiple device types and multiple testing functions. The BMC module provides centralized control that can manage multiple DUTs through resource allocation and coordination, achieving high throughput without proportionally increasing resource requirements.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS12436190B2Functional testing device
Publication Date: 2025.10.07 INVENTEC PUDONG TECH CORPOARTION
  • US12436190B2 patent drawing
  • US12436190B2 patent drawing
  • US12436190B2 patent drawing

AI summary

A functional testing device includes a substrate, an input/output module, a plurality of functional testing modules, a baseboard management control module and a power module. The input/output module is disposed on the substrate and configured to receive a test script. The plurality of functional testing modules are pluggably disposed on the substrate. The baseboard management control module is disposed on the substrate and connected to the input/output module and the plurality of functional testing modules, the baseboard management control module is configured to control the plurality of functional testing modules output a plurality of testing signals according to the test script. The power module is disposed on the substrate and configured to receive and transmit power to the plurality of functional testing modules and the baseboard management control module.