Modular Heatsink for Vehicle Computer Cooling
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Solution Overview
Problem
Existing computer cooling systems lack the robustness and structural integrity needed for automotive environments, particularly in semi-autonomous and autonomous vehicles, where heat generated by computer systems can lead to shutdowns and loss of vehicle control.
Innovation Solution
A thermal management system utilizing modular heatsink assemblies with scalable heat spreaders, thermally coupled to the cooling system, which provides robust cooling, vibration protection, and redundancy to ensure continuous operation of vehicle computer systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If a computer system is used in a vehicle for semi-autonomous or autonomous control, then vehicle automation capability is improved, but heat generation increases to the point where air cooling becomes ineffective
Solution Approach 1:
The cooling system is segmented into multiple independent cooling blocks that can be individually configured and positioned around different heat-generating components. Each cooling block operates as a separate thermal management unit, allowing targeted cooling of specific high-heat areas without requiring complete system redesign.
Solution Approach 2:
Cooling blocks serve as intermediary thermal management components positioned between heat-generating computer components and the surrounding environment. These blocks conduct heat away from critical components through direct thermal contact, acting as a mediator that transfers thermal energy from the computer system to external cooling pathways.
2Reliability
If existing cooling systems are used, then some cooling function is provided, but robustness and structural integrity for automotive environments are insufficient
Solution Approach 1:
The cooling blocks are designed as universal components that can be applied to multiple different computer components and configurations within the vehicle. Each cooling block serves multiple functions: thermal management, structural support, and vibration damping. This multi-functionality reduces overall system complexity while improving reliability.
Solution Approach 2:
The cooling blocks are designed with inherent vibration damping properties that protect computer components from automotive vibrations before damage can occur. The structural design of the cooling blocks provides beforehand cushioning against mechanical shocks and vibrations typical in vehicle environments, preventing potential failures.
3Duration of action of stationary object
If computer components are cooled effectively, then continuous operation is maintained, but heat dissipation requires additional thermal management infrastructure
Solution Approach 1:
The cooling blocks merge thermal management functions with structural support functions into a single integrated component. By combining heat dissipation infrastructure with mechanical support structures, the system reduces overall complexity while maintaining continuous operation capability. The cooling blocks are both thermal pathways and structural elements.
Solution Approach 2:
The cooling blocks are designed to self-regulate thermal pathways and maintain optimal thermal contact with computer components through their structural design. The system utilizes natural heat conduction and convection pathways without requiring complex active control mechanisms, allowing the thermal management infrastructure to serve itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal management system effectively mitigates heat-related failures, improves computer performance, and enhances the reliability and safety of autonomous vehicles by providing reliable cooling and protection against vibrations.
Implementation Method 1
The plurality of cooling blocks can be configured to transfer heat away from a bank of integrated circuits
Implementation Method 2
modular heatsink assemblies with scalable heat spreaders, thermally coupled to the cooling system
Implementation Method 3
modular heatsink assemblies with scalable heat spreaders, thermally coupled to the cooling system
Data Source
AI summary
A thermal management system may cool at least a portion of a computer system with one or more cooling systems. The thermal management system can include one or more modular heatsink assemblies. The modular heatsink assemblies can include scalable heat spreader panels that are thermally coupled to a portion of the one or more cooling systems. The modular heatsink assembly can be positioned above and/or adjacent to a computer component, such as a dual in-line memory module. The scalable heat spreader panels are shaped to fit in between and to the sides of the computing component to draw heat away from the computing component.