Modular 90° Hybrid Coupling Device with Orthogonal Symmetry
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Solution Overview
Problem
Conventional 90° hybrid coupling devices have limited modularity and size constraints, making it difficult to achieve amplitude and phase balance, and are unsuitable for integration in compact devices like integrated circuits due to large size and asymmetric terminal placement.
Innovation Solution
A modular 90° hybrid coupling stage design with orthogonal symmetry axes and overlaid inductive-capacitive metal tracks, allowing for adjustable inductive and capacitive values, and compact size, enabling symmetrical terminal placement and easy integration in silicon-based devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional inductive elements and capacitive elements are used in 90° hybrid coupling devices, then the coupling frequency band is limited and narrow, but the device size becomes too large for integrated circuit implementation
Solution Approach 1:
The coupling device is divided into multiple identical or different modules connected in series. Each module contains inductive metal tracks and capacitive structures that can be independently designed and optimized. This segmentation allows the overall device to achieve broader frequency bandwidth through cascaded stages while keeping each individual module compact for integrated circuit implementation.
Solution Approach 2:
The patent employs overlaid metal tracks in different layers (three-dimensional integration) to create inductive and capacitive circuits. By utilizing vertical stacking and multi-layer PCB or integrated circuit structures, the device achieves the required electrical performance without proportionally increasing the planar footprint, thus reducing the overall device size suitable for integration.
2Ease of operation
If the third and fourth terminals are situated in different sides within the coupling device, then specific adaptations are required for coupled components, but the device requires a larger fingerprint on silicon
Solution Approach 1:
The patent intentionally positions the third and fourth terminals on the same side of the coupling device rather than symmetrically opposite sides. This asymmetric terminal arrangement allows coupled components to be disposed in a parallel manner, simplifying the coupling process and reducing the required silicon footprint by eliminating the need for components to be positioned at opposite ends of the device.
3Reliability
If coils are used as inductive elements in coupling devices, then the coupling function is achieved, but the device size becomes too large for integrated circuit implementation
Solution Approach 1:
The patent replaces traditional coil-based inductive elements with planar inductive metal tracks fabricated using standard integrated circuit or PCB manufacturing processes. This substitution eliminates the need for bulky three-dimensional coils while maintaining the inductive coupling function through carefully designed trace geometries, thereby enabling compact device integration.
Solution Approach 2:
The patent optimizes the geometric parameters of the inductive metal tracks (width, length, spacing, number of layers) to achieve the required inductance values and coupling performance. By adjusting these parameters, the device maintains reliable coupling functionality while minimizing the physical size to be suitable for integrated circuit implementation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a compact, high-performance coupling device with improved modularity, allowing for parallel component coupling and reduced footprint, suitable for integrated circuits and wireless communications applications.
Implementation Method 1
neighboring inductive metal tracks being overlaid in at least one crossing region and designed to form both an inductive circuit and a capacitive circuit
Implementation Method 2
designed to form both an inductive circuit and a capacitive circuit
Data Source
AI summary
A 90° hybrid inductive-capacitive coupling stage includes two first stage terminals capable of forming two stage inputs or two stage outputs and two second stage terminals capable of respectively forming two stage outputs or two stage inputs. The coupling stage is advantageously modular having a first stage axis of symmetry and a second stage axis of symmetry orthogonal to each other with neighboring inductive metal tracks being overlaid in at least one crossing region to form both an inductive circuit and a capacitive circuit. The metal tracks are coupled to the first stage terminals and to the second stage terminals such that the two first stage terminals are situated on one side of the first stage axis of symmetry and the two second stage terminals are situated on the other side of the first stage axis of symmetry.