Coupling Devices TRIZ Cases

A power divider circuit uses an impedance converter and microstrip lines to achieve precise signal distribution.

Overlaid inductive metal tracks create compact coupling stages, reducing silicon footprint for integrated circuit implementation.

A hybrid coupler places sum and difference ports on the same side using a two-layer microstrip structure.

A waveguide coupling with a planar radiating element widens the initial area to improve signal radiation.

Resistive common mode isolators suppress electromagnetic interference to improve isolation from 6 dB to over 20 dB.

A pre-matched power resistance system uses a tiered manifold to transform non-ideal resistors into precise 50Ω impedance networks.

A dual waveguide busbar uses adjustable coupling members to modify phase lengths between microwave filters.

A substrate-mounted choke structure shields high-frequency signals within a hollow waveguide connection interface.

Stepped side walls confine the field to a reduced-height region, boosting coupling efficiency and bandwidth while maintaining SMT compatibility.

A waveguide transition uses a substrate integrated waveguide to bridge microstrip and rectangular waveguide sections, resolving mounting sensitivity issues.

A radial adjustment mechanism varies the distance between conductors to achieve continuous power splitting from 6 to 20 dB without altering main line impedance.

Replacing coaxial structures with a planar microstrip balun eliminates precision cutting costs while maintaining phase control and spectral purity.