Modular Monolithic IC Die Stitching for Low-Power Wafer Testing

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Solution Overview

Problem

The challenge is to reduce power consumption during wafer-level testing of integrated circuits, as increasingly dense ICs exceed the power limits of conventional testing methods, and existing technologies struggle to efficiently manage power distribution across large monolithic integrated circuit dies.

Innovation Solution

A monolithic integrated circuit die is designed with modular die regions, each having separate power distribution networks, allowing independent powering and testing, and interconnected through metal lines, enabling loopback and stitch modes to optimize power usage and testing efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If integrated circuits are made more dense with more logic features, then functionality and integration are improved, but power consumption increases beyond acceptable limits for wafer-level testing

Engineering Contradiction:

Improveintegration densityVSAvoidpower consumption

Core Design Contradiction:

Adaptability or versatilityVSUse of energy by moving object

Solution Approach 1:

The monolithic integrated circuit die is divided into multiple independently powerable die regions (first die region, second die region, etc.), each with its own power distribution network. This segmentation allows only the necessary regions to be powered during testing, reducing overall power consumption while maintaining high integration density across the full die.

Inventive Principle:

Principle #1Segmentation

2Use of energy by moving object

If separate power distribution networks are implemented for each die region, then power consumption during testing is reduced, but device complexity increases

Engineering Contradiction:

Improvepower consumptionVSAvoidpower distribution network complexity

Core Design Contradiction:

Use of energy by moving objectVSDevice complexity

Solution Approach 1:

Multiple die regions are interconnected through metal lines that stitch together their respective power distribution networks, allowing them to function as a unified system when needed. This merging approach enables independent power control during testing while maintaining the capability for full-die operation, balancing power reduction with functional integration.

Inventive Principle:

Principle #5Merging (Combining)

3Productivity

If modular die regions with separate power networks are used, then testing efficiency is improved by enabling selective powering, but manufacturing complexity increases

Engineering Contradiction:

Improvetesting efficiencyVSAvoidmanufacturing complexity

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

Each die region is designed with its own localized power distribution network and can be independently powered and tested. This local quality approach allows testing to focus only on specific regions of interest, improving testing efficiency by avoiding the need to power and test the entire die, while the modular design facilitates standardized manufacturing processes.

Inventive Principle:

Principle #3Local quality

Data Source

PatentEP3017546B1Monolithic integrated circuit die having modular die regions stitched together

Publication Date: 2020.02.12 XILINX INC

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AI summary

An apparatus for a monolithic integrated circuit die (200) is disclosed. In this apparatus, the monolithic integrated circuit die (200) has a plurality of modular die regions (211, 212). The modular die regions (211, 212) respectively have a plurality of power distribution networks (271, 272) for independently powering each of the modular die regions. Each adjacent pair of the modular die regions (211, 212) is stitched together with a respective plurality of metal lines (260, 301 -304, 514, 524).