Modular LED Display Assembly With Recessed Electrodes for Seamless Images

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Solution Overview

Problem

There is a growing demand for large-area, high-resolution full-color display apparatuses that utilize light emitting diodes (LEDs), but existing technologies face challenges in efficiently manufacturing and connecting multiple display modules to achieve seamless image display without image division or dark lines.

Innovation Solution

A multi-module display apparatus is designed with module substrates featuring recesses and connection electrodes, where light emitting devices are electrically connected to conductive members on a support substrate through these electrodes, and the modules are assembled using a ball grid array or conductive bonding members to ensure efficient electrical connectivity and minimize interconnect structures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If multiple display modules are assembled to create large-area displays, then the display area is increased, but image division and dark lines appear between modules

Engineering Contradiction:
Improvedisplay areaVSAvoidimage continuity
Core Design Contradiction:
Area of stationary objectVSManufacturing precision

Solution Approach 1:

The display apparatus is divided into multiple independently manufacturable modules, each with its own substrate and light emitting devices. This segmentation allows for standardized mass production of individual modules while maintaining the capability to create large-area displays through assembly of multiple modules.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Connection electrodes are formed within recesses of the substrate, creating a nested structure where the electrode is embedded in the substrate material. This nesting approach minimizes the protrusion height of connection electrodes, reducing visible seams and dark lines between adjacent modules while maintaining electrical connectivity.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Reliability

If connection structures are added to connect light emitting devices to support substrate, then electrical connectivity is improved, but device complexity increases

Engineering Contradiction:
Improveelectrical connectivityVSAvoidinterconnect structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The connection electrodes are integrated directly into the substrate structure through recesses, merging the connection function with the substrate itself. This eliminates the need for separate connection structures and reduces overall device complexity while maintaining reliable electrical connectivity between light emitting devices and the support substrate.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

Connection electrodes are positioned in the vertical dimension within recesses of the substrate rather than extending horizontally. This dimensional approach allows electrical connections to be made with minimal horizontal protrusion, simplifying the interconnect structure while ensuring reliable electrical contact between modules.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Manufacturing precision

If recesses are formed in module substrates to hold connection electrodes, then electrical connection quality is improved, but manufacturing complexity increases

Engineering Contradiction:
Improveconnection electrode positioningVSAvoidsubstrate processing
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

Recesses for connection electrodes are formed in the substrate before mounting the light emitting devices. This preliminary action allows for precise positioning and integration of connection electrodes into the substrate structure, ensuring high manufacturing precision for electrical connections while establishing a ready-made framework for subsequent assembly steps.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS11881473B2Display apparatus
Publication Date: 2024.01.23 SEOUL SEMICONDUCTOR
  • US11881473B2 patent drawing
  • US11881473B2 patent drawing
  • US11881473B2 patent drawing

AI summary

A display apparatus including a plurality of display modules each including a module substrate and a plurality of light emitting devices mounted on the module substrate, and a support substrate on which the display modules are disposed and including conductive members, in which the module substrates includes a plurality of recesses depressed from at least one end surface of the module substrate, and connection electrodes formed in the recesses, and the light emitting devices are electrically connected to the conducive members of the support substrate through the connection electrodes.