Modular LED Heater with Interlocking Ports for Thermal Uniformity
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Solution Overview
Problem
Large LED arrays used for heating substrates in semiconductor fabrication face challenges due to non-functional LEDs, costly rework, and difficulty in achieving thermal uniformity due to illumination output variations, necessitating a more reliable and cost-effective solution.
Innovation Solution
A modular LED heater system comprising independently fabricated and tested units with plumbing and electrical connections, allowing for coolant flow and customizable power distribution, which can be easily assembled and repaired, reducing the number of connections and enhancing thermal uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If large LED arrays are used to heat substrates, then heating capability is improved, but reliability deteriorates due to non-functional LEDs and solder defects
Solution Approach 1:
The LED array is divided into multiple independent modules, each containing a subset of LEDs (e.g., 800 LEDs per module in an 8000-LED array). This segmentation allows individual modules to be tested, replaced, or repaired independently, improving overall system reliability while maintaining the total heating capability of the large array.
2Power
If large LED arrays are used, then heating capability is improved, but manufacturing cost increases due to rework and replacement
Solution Approach 1:
By segmenting the array into modular units, the cost of rework is reduced from replacing entire arrays to replacing only defective modules. This maintains the heating capability of large arrays while significantly reducing manufacturing and maintenance costs.
Solution Approach 2:
Modules are pre-assembled and tested independently before being integrated into the full array. This preliminary testing identifies and corrects defects early in the manufacturing process, reducing costly rework after array assembly.
3Temperature
If traditional LED arrays are used, then heating function is achieved, but thermal uniformity deteriorates due to illumination variations
Solution Approach 1:
Each LED module is independently calibrated to achieve uniform illumination output. This local quality control ensures that variations in LED performance are compensated at the module level, resulting in uniform thermal distribution across the entire array when all modules are operated together.
Solution Approach 2:
The system incorporates feedback mechanisms to monitor and adjust the output of individual modules, ensuring thermal uniformity across the substrate being heated.
4Ease of repair
If modular LED heaters are used, then ease of repair is improved, but device complexity increases due to multiple connections
Solution Approach 1:
Multiple connection functions (electrical power, ground, and coolant flow) are merged into integrated connectors at each module interface. This reduces the number of separate connections required while maintaining full functionality, making the system easier to repair without excessive complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular LED heater system improves thermal uniformity, reduces repair costs, and allows for individual calibration and replacement of faulty units, enhancing the reliability and efficiency of LED arrays in semiconductor processing.
Implementation Method 1
arrays of light emitting diodes (LEDs)
Implementation Method 2
heating the substrate is through the use of arrays of light emitting diodes (LEDs)
Implementation Method 3
a base having one or more internal conduits through which a coolant fluid may flow
Data Source
AI summary
A modular LED heater and an LED array are disclosed. The modular LED heater comprises a base having one or more internal conduits through which a coolant fluid may flow. The base also includes a plumbing port on one side wall of the base and a recessed port on an opposite side of the base. These ports are configured such that the plumbing port of one modular LED heater can be inserted into the recessed port of the adjacent modular LED heater to form a fluid-tight seal. A printed circuit board having a plurality of LEDs is disposed on the front surface of the base. Further, in some embodiments, the base includes one or more wedge clamps on its side walls used to lock the modular LED heater to an adjacent modular LED heater. An LED array may be created by assembling a plurality of these modular LED heaters.


