Modular LED Display Module for Sensor Integration Without Apertures
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Solution Overview
Problem
Existing optoelectronic components are often manufactured and optimized specifically for a single application, making them costly or impractical for use in other applications, and the integration of sensors in consumer and automotive products requires additional openings or apertures.
Innovation Solution
A modular architecture for optoelectronic components, such as LEDs, is developed, allowing for flexible manufacturing and integration of sensors within displays by using base modules with horizontal chip architecture, enabling easy adaptation for different sizes and applications through layer stacking and mesa structuring, and allowing for the placement of sensors without additional openings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optoelectronic components are manufactured specifically for a single application, then application performance is optimized, but manufacturing cost increases and adaptability to other applications decreases
Solution Approach 1:
The patent divides the optoelectronic component into a standardized base module and application-specific functional elements. The base module contains the LED chip mounted on a substrate with standardized contact pads and mounting structures. This segmentation allows the same base module to be used across multiple applications by simply changing or adding functional elements, thereby reducing manufacturing costs while maintaining application-specific optimization.
Solution Approach 2:
The patent creates a universal base module design that can serve multiple applications. The standardized substrate, contact pad layout, and mounting structures enable the same base module to be adapted for different applications such as displays, lighting, or sensor integration. This multi-functionality approach eliminates the need to manufacture entirely different components for each application, reducing costs while maintaining performance.
2Adaptability or versatility
If sensors are integrated into consumer and automotive products, then functionality is enhanced, but additional openings or apertures in housing are required
Solution Approach 1:
The patent combines the sensor element directly with the base module substrate, integrating both the optoelectronic component and sensor into a single unified structure. The sensor is mounted on the same substrate as the LED chip, sharing common mounting structures, contact pads, and housing integration features. This merging eliminates the need for separate openings or apertures in the housing, as both components can access the environment through the same opening or be positioned adjacent to each other within the same housing cavity.
3Adaptability or versatility
If modular architecture with base modules is used, then manufacturing flexibility and adaptability improve, but device structure becomes more complex
Solution Approach 1:
The patent segments the device into a standardized base module and application-specific functional elements. The base module contains all common structural elements including the substrate, contact pads, mounting structures, and housing interface. This segmentation creates a simple, repeatable modular unit that reduces overall device complexity despite the modular architecture, because each module follows the same standardized design rather than requiring unique structures for each application.
Data Source
AI summary
The invention relates to a method for manufacturing modules with one or more optoelectronic components, comprising the steps: producing at least one layer stack providing a base module on a carrier having a first layer, an active layer formed thereon, and a second layer formed thereon; exposing a surface area of the first layer facing away from the carrier; forming a first contact to a surface region of the second layer facing away from the carrier; and forming a second contact to the surface area of the first layer facing away from the carrier.