Modular Liquid Cooling Architecture With PLC-Governed Immersion
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Solution Overview
Problem
Existing cooling systems for computer hardware in datacenters face inefficiencies due to disparate cooling needs of different components, leading to unnecessary expense and resource wastage, especially when immersion cooling is required for some components but not others, and direct communication between components with varying cooling requirements is desired.
Innovation Solution
A modular liquid cooling system comprising infrastructure and payload modules, where the infrastructure module uses convective air cooling or cold plates, and the payload module uses immersion cooling, governed by a programmable logic controller (PLC) for centralized management, allowing flexible deployment and efficient heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If immersion cooling is used for all components in a datacenter, then high-power components are effectively cooled, but low-power components waste cooling resources and increase system complexity
Solution Approach 1:
The datacenter is divided into multiple zones with different cooling methods: immersion cooling zones for high-power components and convective cooling zones for low-power components. This segmentation allows each component type to receive appropriate cooling, eliminating waste while maintaining effectiveness.
Solution Approach 2:
Different cooling methods are applied to different locations within the datacenter based on local heat generation characteristics. High-power components are placed in immersion cooling zones, while low-power components are placed in convective cooling zones, optimizing resource allocation.
2Ease of operation
If all components are placed in a single immersion cooling tank, then direct communication between components is simplified, but components with low cooling needs waste resources and increase tank crowding
Solution Approach 1:
The system segments components into different cooling zones rather than placing all components in a single tank. This allows selective immersion cooling for high-power components while maintaining convective cooling for low-power components, reducing overall cooling fluid volume requirements.
3Device complexity
If a unified cooling system is implemented for all hardware, then system simplicity is maintained, but flexibility to accommodate disparate cooling needs is reduced
Solution Approach 1:
The datacenter cooling system is designed to support multiple cooling methods simultaneously (immersion cooling and convective cooling), allowing it to adapt to different component requirements. This multi-functionality provides flexibility while maintaining a unified architectural framework.
Solution Approach 2:
The system dynamically assigns cooling methods to different components based on their thermal characteristics and cooling requirements. This dynamic allocation allows the system to adapt to varying hardware needs without requiring a completely separate cooling infrastructure for each component type.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient cooling of components with varying power consumption levels in a single location, optimizing resource use and simplifying maintenance by centralizing control, while allowing easy access and reducing unnecessary immersion cooling expenses.
Implementation Method 1
a liquid-air heat exchanger
Implementation Method 2
cold plates with heat transferred locally to facility water
Implementation Method 3
immersion cooling systems may include a tank in which computer hardware may be immersed in evaporable liquid
Implementation Method 4
evaporable liquid
Implementation Method 5
a condenser positioned above the tank
Data Source
AI summary
A housing and cooling system for computer hardware includes an infrastructure module and a payload module. The infrastructure module is configured for housing computer hardware and is equipped with either or both of a convective air cooling system and an arrangement of metal plates connected by one or more conduits for carrying liquid for cooling computer equipment housed by the infrastructure module. The infrastructure modules also houses a programmable logic controller (“PLC”). The payload module includes an immersion cooling system governed by the PLC and is located outside of the infrastructure module.