Modular Liquid Cooling Plate Structure for Multi-Chip Adaptation
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Solution Overview
Problem
Conventional liquid cooling heat dissipation apparatuses require customization for different chip specifications, complicating production and reducing adaptability.
Innovation Solution
A modularized standard separated structure with a heat-conducting plate sandwiched between a mounting base and a pressing plate, allowing for universal use across various chips by selecting only the corresponding heat-conducting plate, while using standard mounting bases and pressing plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an integrated structure liquid cooling heat dissipation apparatus is used, then heat dissipation effectiveness is improved, but adaptability to different chip specifications deteriorates
Solution Approach 1:
The heat dissipation apparatus is divided into separate modules: a mounting base, a heat-conducting plate, and a pressing plate. These modules can be independently selected and combined based on different chip specifications, allowing the system to maintain effective heat dissipation while adapting to various chip sizes and thermal requirements.
Solution Approach 2:
The mounting base and pressing plate are designed as universal components that can accommodate multiple chip specifications. The mounting base includes a positioning structure that can adapt to different chip dimensions, and the pressing plate applies uniform pressure across various chip sizes, enabling a single set of these components to serve multiple heat dissipation configurations.
2Adaptability or versatility
If different liquid cooling heat dissipation apparatuses are designed for various chip specifications, then adaptability is improved, but device complexity increases
Solution Approach 1:
By segmenting the heat dissipation apparatus into standardized modules (mounting base, heat-conducting plate, pressing plate), the system reduces complexity. Instead of designing entirely different apparatuses for each chip specification, only the heat-conducting plate needs to be varied, while the mounting base and pressing plate remain standardized across all configurations.
Solution Approach 2:
The mounting base and pressing plate serve as universal components across all chip specifications, reducing the number of unique parts needed. This modular approach allows a single set of mounting and pressing plates to work with multiple heat-conducting plates of different sizes, thereby simplifying the overall system complexity.
3Adaptability or versatility
If different liquid cooling heat dissipation apparatuses are designed for various chip specifications, then adaptability is improved, but production difficulty increases
Solution Approach 1:
Segmenting the apparatus into standardized modules simplifies manufacturing. The mounting base and pressing plate can be mass-produced as standard components, while only the heat-conducting plate requires customization based on chip specifications. This significantly reduces production complexity compared to manufacturing entirely different apparatuses for each chip type.
Solution Approach 2:
The universal mounting base and pressing plate can be produced using the same manufacturing processes and tooling for all chip specifications, reducing setup costs and production complexity. Only the heat-conducting plate requires variant production, making the overall manufacturing process more efficient and scalable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances adaptability and simplifies production by eliminating the need for multiple apparatuses, improving heat transfer efficiency and reducing manufacturing complexity.
Implementation Method 1
heat is dissipated from the chip by circulating liquid inside the heat dissipation apparatus
Implementation Method 2
The heat-conducting plate includes a first surface and a second surface that are disposed opposite to each other, the mounting base is configured to bear the heat-conducting plate
Data Source
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AI summary
This application provides a heat dissipation apparatus, a device, a rack, and a system. The heat dissipation apparatus mainly includes a heat-conducting plate, where a liquid channel is disposed on a first surface of the heat-conducting plate; a mounting base, where an accommodation cavity configured to accommodate a partial area that is in the heat-conducting plate and that includes a second surface is disposed on the mounting base, and the first surface and the second surface are disposed opposite to each other; and a pressing plate, configured to fasten the heat-conducting plate in the accommodation cavity, where the pressing plate is detachably and firmly connected to the mounting base, a sealing cavity is formed between the pressing plate and the first surface of the heat-conducting plate, the sealing cavity is configured to accommodate the liquid channel, and a liquid inlet connector and a liquid outlet connector that are connected to the liquid channel are disposed on the pressing plate. In the foregoing structure, the entire heat dissipation apparatus uses a modularized standard separated structure, and the pressing plate and the mounting base may be made into standard parts. When heat dissipation is performed on chips having different heat dissipation requirements, only a corresponding heat-conducting plate needs to be selected as required, and the mounting base and the pressing plate may still be used. This improves adaptability of the heat dissipation apparatus.