Modular Memory Module Sockets for Compact EDSFF SSD Expansion
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Solution Overview
Problem
Current memory devices, such as solid-state drives (SSDs), particularly in the Enterprise and Data Center Standard Form Factor (EDSFF) E3, lack a modular design that efficiently accommodates multiple memory modules and provides easy accessibility and secure connection, limiting their flexibility and compatibility with existing systems.
Innovation Solution
A memory device with a substrate plate featuring edge connectors, memory control modules, and removable sockets, where the memory control module is positioned on either the top or bottom side, and retention clips ensure secure engagement of memory modules, allowing for modular expansion and compatibility with existing host devices via SFF-TA-1002 standards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a modular design with removable sockets is implemented, then adaptability and ease of operation are improved, but device complexity increases
Solution Approach 1:
The memory device is divided into modular components including a substrate plate, removable sockets, retention clips, and memory modules. This segmentation allows individual components to be independently manufactured, tested, and replaced, improving adaptability while managing complexity through standardized interfaces.
Solution Approach 2:
The substrate plate serves multiple functions: providing structural support, electrical connectivity through the edge connector, mechanical mounting for sockets and memory modules, and heat dissipation pathways. This multi-functionality reduces the need for additional components, balancing adaptability with device complexity.
2Productivity
If multiple memory modules are accommodated in a compact arrangement, then productivity and area utilization are improved, but manufacturing precision requirements increase
Solution Approach 1:
Multiple memory modules are arranged in a three-dimensional configuration on the substrate plate, utilizing vertical stacking and lateral positioning to maximize space utilization. This dimensional approach allows high density without proportionally increasing manufacturing precision requirements, as the modular socket interface absorbs positioning tolerances.
Solution Approach 2:
The design incorporates adjustable parameters such as socket positioning tolerances, retention clip engagement forces, and memory module insertion depths. These parameter variations allow manufacturing within standard precision ranges while maintaining reliable electrical and mechanical connections for multiple memory modules.
3Reliability
If retention clips are used to secure memory modules, then reliability is improved, but device complexity increases
Solution Approach 1:
The retention clips are designed to automatically engage with memory modules upon insertion and provide secure mechanical retention without requiring additional fastening operations. This self-service mechanism ensures reliable connection while minimizing the number of discrete components and assembly steps, balancing reliability with device complexity.
Data Source
AI summary
A memory device with modular design and the memory system comprising the same is disclosed. The memory device comprises a substrate plate having a front edge, a rear edge opposite to the front edge, and a top side and a bottom side which are opposite to each other and extend between the front edge and the rear edge; an edge connector positioned at the rear edge and configured to connect to a host connector of a host device; a memory control module positioned on one of the top side and the bottom side of the substrate plate; at least one socket positioned on the top side of the substrate plate and configured to connect to at least one removable memory module; and wherein the memory controller module is electrically coupled to the edge connector and the at least one socket such that the at least one memory module can be accessible by the host device via the memory control module.