Modular Injection Mold Covers for Variable Power Module Pin Layouts
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Solution Overview
Problem
The existing injection mold technology is not compatible with power modules of the same series that have different pin locations, leading to long development cycles and high costs, as the entire mold needs to be replaced for each design change or new power module development.
Innovation Solution
An injection mold design featuring a housing with a mold cavity and a detachable cover with varying via arrangements, allowing the same set of molds to accommodate power modules with different pin locations by replacing covers with corresponding via configurations, enabling injection sealing without replacing the entire mold.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the entire injection mold is replaced when pin location changes, then the power module can accommodate different pin locations, but the development cycle becomes long and costs increase
Solution Approach 1:
The injection mold is segmented into a fixed housing and a detachable cover. The housing contains the mold cavity and remains stationary, while the cover is replaceable and contains the vias that match pin locations. This segmentation allows only the cover to be changed when pin locations change, rather than replacing the entire mold, thus reducing development time and costs.
Solution Approach 2:
The housing is designed with universal functionality to work with multiple covers having different via arrangements. The housing provides the fundamental molding structure and cavity, while different covers can be attached to the same housing to accommodate various pin location configurations, making the system adaptable to different power module designs without requiring complete mold replacement.
2Adaptability or versatility
If the entire injection mold is replaced when pin location changes, then the power module can accommodate different pin locations, but manufacturing costs increase
Solution Approach 1:
The injection mold is segmented into a fixed housing and a detachable cover. The housing contains the mold cavity and remains stationary, while the cover is replaceable and contains the vias that match pin locations. This segmentation allows only the cover to be changed when pin locations change, rather than replacing the entire mold, thus reducing development time and costs.
Solution Approach 2:
The cover is designed as a relatively simple, replaceable component compared to the entire injection mold. When pin locations change, only the cover needs to be replaced rather than the expensive and complex housing structure. This makes the adaptation process more cost-effective by replacing a cheaper component instead of the entire mold system.
3Adaptability or versatility
If the entire injection mold is replaced when pin location changes, then the power module can accommodate different pin locations, but production line efficiency decreases
Solution Approach 1:
The injection mold is segmented into a fixed housing and a detachable cover. The housing contains the mold cavity and remains stationary, while the cover is replaceable and contains the vias that match pin locations. This segmentation allows only the cover to be changed when pin locations change, rather than replacing the entire mold, thus reducing development time and costs.
Solution Approach 2:
The cover is designed to be dynamically replaceable on the production line. Different covers can be quickly attached and detached from the housing depending on the pin location requirements of the power module being manufactured. This dynamic adaptability allows the production line to switch between different power module configurations without lengthy mold replacement procedures, thereby maintaining high productivity.
Data Source
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AI summary
An injection mold and an injection molding method are provided. The injection mold includes a housing and a cover. The housing is provided with a mold cavity. The mold cavity is configured to accommodate a power module. The cover is provided with a plurality of vias. The cover is detachably connected to the housing. The cover is located in the mold cavity and locates the power module jointly with the housing. The plurality of vias are configured to match a plurality of pins of the power module. In this application, the cover is disposed, and the cover is provided with the vias for pins to pass through. By using covers with different arrangement manners of vias, a same set of injection molds can be compatible with power modules of a same series that have different locations of pins. Arrangement manners of vias on different covers are different. When injection molding is performed on power modules with different arrangement manners of pins, injection sealing can be implemented only by using a cover provided with corresponding vias, without replacing the entire injection mold. This can resolve problems of a long development cycle and high costs of the injection mold.