Modular Quantum Entanglement Architecture for Scalable Cryogenic Qubits
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Solution Overview
Problem
Implementing quantum computing systems in a scalable and interconnected manner with practical physical resources such as electrical power, chip count, and cooling power while maintaining a practical device footprint is challenging.
Innovation Solution
A modular quantum system comprising interconnected modular cells with cryogenic and room temperature structures, using optical and electrical connections, and entanglement devices like seed state generators, resource state projection systems, and fusion network projection systems to perform projective measurements on qubits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If quantum computing systems are implemented with interconnected qubits using available physical resources, then quantum information processing capability is improved, but device footprint and system complexity increase
Solution Approach 1:
The patent divides the quantum computing system into modular units, each containing a controlled number of qubits and associated control electronics. These modular units can be independently fabricated, tested, and then interconnected to form larger quantum systems, thereby managing complexity through systematic division while maintaining scalability.
Solution Approach 2:
The patent transitions from planar integration to three-dimensional vertical stacking of modular quantum units. By stacking multiple layers of qubit arrays and control electronics vertically, the system achieves higher qubit density and processing capability without proportionally increasing the horizontal device footprint, thus resolving the contradiction between capability and complexity.
2Power
If more qubits are interconnected to increase processing power, then quantum computational capacity is improved, but electrical power and cooling power requirements increase
Solution Approach 1:
The patent introduces cryogenic control electronics that operate at intermediate temperatures between the qubits (requiring millikelvin temperatures) and room temperature classical systems. These intermediary control stages perform quantum state manipulation and measurement functions, reducing the need for high-power room temperature electronics and minimizing the cooling power burden while maintaining computational capacity.
Solution Approach 2:
The patent optimizes the operating temperature parameters of different system components, with qubits operating at millikelvin temperatures and control electronics operating at progressively higher temperatures up to room temperature. This parameter stratification allows the system to achieve high computational capacity with qubits while reducing the power consumption and cooling requirements of the overall system by allowing higher-power operations at warmer temperatures.
3Productivity
If quantum systems are scaled up with more qubits and interconnections, then information processing capability is improved, but practical device footprint increases
Solution Approach 1:
The patent implements a nested hierarchical structure where qubit arrays are organized into modular units, which are then stacked vertically to form larger quantum systems. Each modular unit contains nested layers of qubits and control electronics, allowing the system to scale from tens to thousands of qubits within a compact footprint by efficiently utilizing three-dimensional space rather than expanding horizontally.
Data Source
AI summary
A modular quantum entanglement processing system can include a plurality of seed state systems, resource state systems, and fusion systems that can be ordered in different arrangements. The systems can be composed of modular assemblies or chips, such that the systems can be modularized and extended to perform entanglement based processing of tasks in a scalable manner. Some of the assemblies or chips of the different systems can be designed to operate at cryogenic temperatures, such as detector, while other assemblies or chips of the different systems can operate at room temperature, where the different chip types can be coupled to one another using fiber optic cables.