Modular Ultrasonic Generator Digital Control Architecture
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Solution Overview
Problem
Current ultrasonic welding devices have complex architectures that are difficult to assemble and service, with low power density, sensitivity to noise, and limited adjustable control methods due to analog components, making them inefficient and inflexible.
Innovation Solution
A modular, compact ultrasonic generator with a digital controller that includes an input module, output module, and motherboard for easy assembly and serviceability, featuring digital components for improved flexibility and accuracy, along with advanced features like phase lock loop adjustments and power regulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional design methods with analog components are used, then the ultrasonic generator can be assembled and operated, but the device complexity increases and ease of manufacture decreases
Solution Approach 1:
The ultrasonic generator is divided into separate functional modules (power supply module, control module, ultrasonic generation module) that can be independently assembled and serviced. This modular architecture reduces overall device complexity while improving ease of manufacture and assembly.
Solution Approach 2:
Analog mechanical/electrical control systems are replaced with digital control circuitry and microprocessors. This substitution reduces the number of physical components, simplifies the circuitry, and improves both ease of manufacture and device reliability.
2Power
If conventional packaging methods are used, then the ultrasonic generator can be assembled, but the power density of the packaged system is relatively low
Solution Approach 1:
Components are arranged in a nested configuration where smaller modules are integrated within larger housing structures. This nesting approach maximizes power density by efficiently utilizing internal space while maintaining a compact overall packaging architecture.
Solution Approach 2:
The packaging architecture transitions from conventional two-dimensional layouts to three-dimensional spatial arrangements. Components are positioned in multiple vertical and horizontal layers, increasing power density without significantly increasing the footprint.
3Area of stationary object
If mostly analog components are used in the design, then the ultrasonic generator can operate, but it will have greater sensitivity to noise and require a larger amount of circuit board component space
Solution Approach 1:
Analog components are replaced with digital electronics and microprocessors. This substitution reduces circuit board space requirements by integrating multiple functions into single chips while simultaneously reducing sensitivity to electrical noise through digital signal processing.
Solution Approach 2:
Multiple discrete analog components are merged into integrated circuits and modular assemblies. This consolidation reduces the total circuit board area required while improving noise immunity through coordinated design of the integrated systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables easier system assembly, improved fault diagnostics, and enhanced weld quality with increased accuracy and repeatability, reducing mechanical and electrical component requirements, and extending the life of ultrasonic stack components.
Implementation Method 1
The output module may include an impedance matching network and a piezoelectric stack assembly.
Implementation Method 2
The output module may include an impedance matching network and a piezoelectric stack assembly or other magnetic or mechanical components adapted to output an ultrasonic signal.
Data Source
Figure 1
Figure 2a~2d
Figure 3a~3e
AI summary
An ultrasonic generator for an ultrasonic welding system comprises a chassis with an AC power line input 20 and a housing a motherboard assembly 14 that includes fixed connectors for directly connecting the motherboard 14 to a plurality of modules 10, 11, 12 without wire harnesses to form a modular system. One of the fixed connectors is an option module connector 32 for connection to an option module. The modular system 10, 11, 12 is operable to rectify and filter the AC power from the AC power line input 20 to DC power, to convert the DC power to AC power with an ultrasonic frequency, and to match an impedance of the AC power with an ultrasonic frequency to efficiently transfer that AC power to an ultrasonic transducer that delivers the ultrasonic frequency energy to a load. The motherboard assembly 14 further includes a digital controller configured to control and monitor the plurality of modules 10, 11, 12. The digital controller is configured to control a probe actuator device in a welding process, to begin the welding process by applying a low level of adjustable ultrasound output to parts joined by the welding process, to monitor a power level as a force applied to the parts increases, and to start the welding process in response to detecting a user-programmed trigger power level, without using a load cell or force transducer to directly measure the force applied to the parts.