Module Device Floating Bump Signal Wire Arrangement
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Solution Overview
Problem
Existing module devices with surface acoustic wave chips have limitations in size reduction due to the arrangement of signal wires, as the columnar conductor must be joined to a ground pad, restricting flexibility and increasing device size.
Innovation Solution
A module device with a filter chip featuring a piezoelectric substrate, bumps for connection to electrode lands and signal wires, including a floating bump that is electrically connected to the signal wire, allowing for flexible arrangement and reduced size by eliminating the need for a ground connection in the mount region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the columnar conductor is joined to the ground pad on the circuit substrate, then the joining strength of the surface acoustic wave chip to the circuit substrate is enhanced, but there are limitations on arrangement of signal wire in the mount region and size reduction cannot be achieved
Solution Approach 1:
The invention divides the connection structure into multiple independent bumps (first bump for signal, second bump for ground, third bump for signal wire connection). This segmentation allows each bump to serve a specific function independently, enabling flexible signal wire arrangement while maintaining strong joining strength through multiple connection points.
Solution Approach 2:
The third bump serves multiple functions: it provides mechanical support for joining the filter chip to the module substrate and simultaneously serves as an electrical connection point for the signal wire. This multi-functionality eliminates the need for separate ground pad connections, enhancing both joining strength and arrangement flexibility.
2Reliability
If the columnar conductor is joined to the ground pad, then electrical connection is established, but the device size cannot be reduced due to restricted signal wire arrangement
Solution Approach 1:
The invention merges the mechanical support function and electrical connection function into the same third bump structure. By combining these functions, the signal wire can be arranged more flexibly within the mount region, reducing the overall device size while maintaining reliable electrical connections through the multiple bump structure.
Solution Approach 2:
The invention utilizes the vertical dimension by extending the third bump to connect with the signal wire from below, allowing signal wire arrangement in three-dimensional space rather than being constrained to a two-dimensional plane. This enables more compact device layout while maintaining electrical reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases flexibility in signal wire arrangement, enabling size reduction of the module device while maintaining sufficient joining strength and minimizing deterioration of electrical characteristics.
Implementation Method 1
the filter chip is an elastic wave filter chip, and the chip substrate is a piezoelectric substrate
Data Source
AI summary
A module device includes electrode lands and signal wires on an upper surface defining one main surface of a module substrate. A filter chip is mounted on the module substrate. The filter chip includes first bumps connected to a signal potential, second bumps connected to a ground potential, and a third bump not electrically connected to a functional electrode portion. In a mount region, the third bump which is a floating bump is electrically connected to the signal wire.