Module Frame Direct Connection Reduces Wiring Resistance
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Solution Overview
Problem
Conventional DC-DC converters face issues with high wiring resistance and inductance, leading to increased power consumption, degraded switching performance, and electromagnetic interference, especially in high-frequency applications.
Innovation Solution
A module configuration where functional devices are directly connected via frames acting as connection terminals, reducing the distance and cross-sectional area of the connection path, thereby minimizing wiring resistance and inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If functional devices are connected through wiring formed on a printed circuit board, then the devices can be electrically connected, but the wiring resistance and inductance increase
Solution Approach 1:
The patent merges the connection function by having the frame directly connect both functional devices, eliminating the need for separate wiring on the printed circuit board. The frame serves as a common connection structure that directly joins the first and second functional devices, reducing the total connection path and minimizing resistance.
Solution Approach 2:
The patent transitions from planar wiring on the printed circuit board surface to a three-dimensional direct connection through the frame structure. This spatial reconfiguration reduces the path length by moving connections into the vertical dimension rather than relying solely on surface-mounted wiring.
2Reliability
If functional devices are connected through wiring formed on a printed circuit board, then the devices can be electrically connected, but the wiring inductance increases
Solution Approach 1:
The frame merges the connection paths for both functional devices into a single integrated structure, reducing the total loop area and thus minimizing inductance. By providing direct mechanical and electrical contact through the frame, the patent eliminates the need for extended wiring paths that would increase inductive effects.
Solution Approach 2:
The patent reduces inductance by reconfiguring the connection geometry from extended planar wiring to compact three-dimensional direct contact through the frame, minimizing the loop area and magnetic field generation.
3Loss of energy
If the wiring length is reduced to decrease resistance and inductance, then power consumption decreases and performance improves, but the design flexibility and ease of connection to other devices is reduced
Solution Approach 1:
The frame is designed to serve multiple functions: it provides direct electrical connection between functional devices, acts as a mechanical support structure, and includes connection terminals that enable flexible external connections. This multi-functionality maintains design flexibility while minimizing wiring length through the integrated frame structure.
Solution Approach 2:
The frame is segmented to include specific connection terminals at strategic locations, allowing flexible external connections while maintaining short internal connection paths. The segmentation enables the frame to adapt to different circuit configurations without increasing the core connection length between functional devices.
Data Source
AI summary
A module (1) includes a first functional device (2) and a second functional device (3). The first functional device (2) includes a base electrode, an emitter electrode and a collector electrode. The second functional device (3) includes at least one electrode. The module (1) further includes a conductive frame (4). One of the base electrode, the emitter electrode, and the collector electrode of the first functional device (2) is directly connected to the frame (4). The electrode of the second functional device (3) is also directly connected to the frame (4). The frame (4) includes a portion serving as a terminal for external connection.