Semiconductor Module Sleeve Welding for Stable Pin Connection
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Solution Overview
Problem
Existing semiconductor modules face issues with the sleeve being easily inclined or displaced relative to the substrate during soldering, and joint portions susceptible to deterioration due to temperature cycling, especially when the load is concentrated on the joint between the substrate and the sleeve.
Innovation Solution
A semiconductor module design that includes an insulating substrate with a metal plate joined to a tubular sleeve via resistance welding, where weld marks on the sleeve's end face cover a smaller area than the end face, and a pin is inserted into the sleeve, stabilizing the sleeve's orientation and enhancing join strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the sleeve and substrate are joined by soldering, then the joining process is simple, but the sleeve is easily inclined or displaced during melting and solidification of solder
Solution Approach 1:
The patent replaces the soldering process (thermal-chemical joining) with resistance welding (electrical-thermal mechanical joining). The resistance welding process uses electrical current to generate heat at the contact interface between the sleeve and substrate, creating a strong metallurgical bond without the liquid phase issues of soldering. This substitution eliminates sleeve inclination and displacement problems while maintaining manufacturing feasibility.
Solution Approach 2:
The patent changes the joining parameters from soldering (melting temperature, solidification time, flux chemistry) to resistance welding (electrical current, contact pressure, welding time). This parameter change transforms the joining mechanism from a thermal-chemical process with liquid phase to an electrical-thermal mechanical process with solid-phase diffusion bonding, thereby improving positioning accuracy while keeping the process simple.
2Device complexity
If the load is concentrated on the joint portion between substrate and sleeve, then the structural design is simple, but the joint portion is susceptible to deterioration due to temperature cycling
Solution Approach 1:
The patent replaces solder joints with resistance weld joints, creating a metallurgical bond that is inherently more resistant to thermal fatigue and temperature cycling. The resistance welding process creates a diffusion bond with intermetallic compound formation, which provides superior mechanical and thermal stability compared to solder joints, thereby improving reliability without complicating the structural design.
Solution Approach 2:
The resistance welding process creates a composite joint structure consisting of the sleeve material, substrate material, and intermetallic compounds formed during welding. This composite structure combines the advantages of different materials to achieve high strength and resistance to temperature cycling, improving joint durability while maintaining design simplicity.
3Strength
If the weld mark area covers the entire first end face, then the joining strength is maximized, but the joining time is extended and heat impact increases
Solution Approach 1:
The patent applies local quality by concentrating the weld marks at specific locations on the first end face of the sleeve rather than covering the entire surface. The weld marks are positioned at the periphery or at optimized locations that provide sufficient joining strength through localized metallurgical bonding, thereby reducing the overall welding time and heat impact while maintaining adequate joint strength.
Solution Approach 2:
The patent uses partial action by forming weld marks that cover only a portion of the first end face area. This partial coverage is sufficient to achieve the required joining strength for the application, avoiding the excessive heating and extended time associated with full-surface welding, thus optimizing the trade-off between strength and joining time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces sleeve displacement and joint deterioration, improving the reliability and durability of the semiconductor module by minimizing heat impact and shortening the joining time, while maintaining strong electrical connections.
Implementation Method 1
at least one weld mark is formed by resistance welding on the first end face and a surface of the metal plate that faces the first end face
Implementation Method 2
a joining step of joining the first end face to the metal plate by resistance welding
Data Source
AI summary
The semiconductor module includes an insulating substrate with an insulating plate and a metal plate joined to one face of the insulating plate; a tubular sleeve with a first end face joined to the metal plate and a second end face opposite to the first end face; and a pin inserted into the sleeve. At least one weld mark is formed by resistance welding on the first end face and a surface of the metal plate that faces the first end face, and an area of the at least one weld mark formed by resistance welding is less than an area of the first end face.