Electronic Component Module Reinforcement Against Space Collapse
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Solution Overview
Problem
Existing electronic component modules face the challenge of space collapse due to high pressure applied during resin molding, which deforms the protection device and collapses the space intended for wave propagation in SAW or BAW elements.
Innovation Solution
A method involving the use of a reinforcing plate with an adhesive layer, fixed between the protection device and the electronic component, to prevent space collapse, where the reinforcing plate is made of Si and the electronic component includes a piezoelectric substrate with a drive device and protection device structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If resin molding is performed to form a resin layer covering the electronic component, then the electronic component is protected and encapsulated, but the protection device is deformed and the space is collapsed due to relatively-high pressure applied to the resin
Solution Approach 1:
A reinforcing plate is mounted on the protection device before the resin molding process. This preliminary action strengthens the protection device structure in advance, enabling it to withstand the high pressure of resin injection without deforming or collapsing the internal space, thus resolving the contradiction between achieving reliable encapsulation and maintaining manufacturing precision
Solution Approach 2:
The protection device is enhanced by combining it with a reinforcing plate made of a different material (e.g., metal or rigid polymer). This composite structure integrates the protective function of the original device with the mechanical strength of the reinforcing plate, allowing the assembly to resist deformation during resin molding while maintaining the required space geometry
2Ease of manufacture
If relatively-high pressure is applied to resin during molding, then the resin layer is properly formed to cover the electronic component, but the protection device is deformed
Solution Approach 1:
The reinforcing plate is installed on the protection device before resin molding begins. This preliminary reinforcement allows the molding process to proceed with normally high pressure for easy manufacturing, while the reinforcing plate prevents the protection device from deforming under that pressure
Solution Approach 2:
The reinforcing plate acts as an intermediary element between the protection device and the resin molding process. It absorbs and distributes the high pressure applied during molding, preventing direct transmission of deforming forces to the protection device, thus enabling easy manufacturing without compromising the device shape
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents the collapse of the space around the drive device, ensuring effective wave propagation and maintaining the structural integrity of the protection device during resin molding.
Implementation Method 1
an adhesive layer is previously formed on a surface of the reinforcing plate, and the reinforcing plate is fixed such that the adhesive layer is located between the protection device and the reinforcing plate
Data Source
AI summary
A method for producing an electronic component module prevents a space from collapsing. The method includes a step of preparing an electronic component including an element substrate, a drive device formed on a principal surface of the element substrate, and a protection device covering the drive device so as to form a space around the drive device; a step of fixing the electronic component on a common substrate such that a principal surface of the common substrate and another principal surface of the element substrate face each other; a step of fixing a reinforcing plate on the protection device of the electronic component; and a step of forming a resin layer on the principal surface of the common substrate such that the electronic component is contained therein.