Mold Spacer for Homogeneous Electrical Conductor Insulation
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Solution Overview
Problem
Conventional methods for manufacturing insulation layers for electrical conductors, such as using mica-based insulation tape with resin and Vacuum Pressure Impregnation (VPI), result in high costs, inhomogeneous insulation, and a complex chemical process.
Innovation Solution
A method and assembly that enclose an electrical conductor in a mold cavity, using a movable spacer to maintain a gap and fill it with an insulation compound, which is then cured to form a homogeneous insulation layer, eliminating the need for mica-based tapes and VPI.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If mica-based insulation tape and VPI process are used, then insulation layer can be formed, but manufacturing cost increases and insulation homogeneity deteriorates
Solution Approach 1:
The patent changes the physical state and application method of the insulation compound from liquid resin infiltration (VPI) to paste-like material applied in semi-solid state. This parameter change enables better control of insulation thickness and composition distribution, achieving homogeneous insulation without the high costs and complexity of VPI processing
Solution Approach 2:
The patent extracts and eliminates the VPI process step from the manufacturing sequence. By applying insulation compound directly in semi-solid state before final curing, the method removes the need for vacuum pressure impregnation equipment and complex chemical processing, reducing manufacturing cost while maintaining insulation quality
2Reliability
If VPI process is used, then insulation layer can be formed, but process complexity increases
Solution Approach 1:
The patent extracts and eliminates the VPI process step from the manufacturing sequence. By applying insulation compound directly in semi-solid state before final curing, the method removes the need for vacuum pressure impregnation equipment and complex chemical processing, reducing manufacturing cost while maintaining insulation quality
Solution Approach 2:
The patent replaces the complex chemical-mechanical VPI system with a simpler mechanical application process. The insulation compound is applied in semi-solid state using straightforward mechanical means, then cured through simple heating, eliminating the need for vacuum chambers, pressure systems, and chemical catalysts required by VPI
3Manufacturing precision
If spacer is movable from hole into cavity, then gap can be maintained for insulation compound filling, but device complexity increases
Solution Approach 1:
The patent employs a movable spacer that transitions from a retracted position in the mold cavity to an extended position that defines the insulation gap. This dynamic element allows the mold to maintain simple structure during insulation compound application while ensuring precise, uniform gap formation, resolving the contradiction between manufacturing precision and device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, ensures a homogeneous insulation layer for improved electrical performance, and allows for flexibility in compound composition and easier repair, while eliminating the VPI process.
Implementation Method 1
The insulation compound fills entire gap between the electrical conductor and the surface of the cavity forming the insulation layer
Data Source
AI summary
An assembly and a method for manufacturing an insulation layer of an electrical conductor are presented. The electrical conductor is enclosed in a cavity of a mold. Spacers embedded into holes of the mold are movable into the cavity for holding the electrical conductor in the cavity to maintain a gap between the electrical conductor and surface of the cavity. Distance of the gap is defined by thickness of the insulation layer. Spacers are movable into the holes of the mold from the cavity to maintain even surface of the cavity. Insulation compound fills entire gap and is cured to form the insulation layer having homogenous thickness.