Molded Dual-Camera Photosensitive Assembly for Optical Axis Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current dual lens camera modules face challenges in ensuring uniform imaging quality due to uncontrollable dimension and position parameters, leading to deviations in the optical axis alignment and increased thickness, which affects image synthesis and overall rigidity, and are prone to contamination from exposed circuit components.
Innovation Solution
A molded photosensitive assembly with a mold sealer that encloses photosensitive units and lead wires, providing a sealed and integrated structure with a reinforcing layer for enhanced strength and heat dissipation, and a supporting member to protect components during molding, ensuring precise alignment and reduced thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If discrete lens bases are mounted on the circuit board, then the camera module can be assembled, but the dimension and position parameters become uncontrollable leading to optical axis deviation
Solution Approach 1:
The patent merges the lens base and circuit board into a single integrated structure where the lens base is directly formed as part of the circuit board assembly. This integration eliminates the discrete mounting of lens bases, ensuring precise and controllable dimension and position parameters for optical axis alignment while reducing assembly complexity.
2Reliability
If lens motor assemblies are enveloped by supporting frame, then components are protected, but the overall thickness of the camera module increases
Solution Approach 1:
The patent employs a thin film-like supporting frame structure that provides necessary protection for lens motor assemblies while minimizing thickness. The supporting frame is designed as a sleek, minimal-profile component that encapsulates the lens motor assemblies without adding excessive bulk, thus maintaining component protection while reducing overall module thickness.
3Ease of manufacture
If circuit board is used to connect lens bases, then electrical connections are established, but the overall rigidity of the camera module is insufficient
Solution Approach 1:
The patent utilizes a composite structure combining the circuit board with additional reinforcing materials or structures to enhance overall rigidity. The circuit board is integrated with support ribs, reinforcement layers, or rigid housing elements that provide the necessary structural strength while maintaining electrical connection capabilities for the lens bases.
4Ease of manufacture
If exposed circuit components are present, then electrical functions are implemented, but the module is prone to contamination
Solution Approach 1:
The patent extracts or encloses exposed circuit components within protective housings or sealed chambers. The circuit board and its components are positioned inside the supporting frame structure, which acts as a protective barrier against contamination. This extraction of circuit components from the external environment maintains electrical functionality while preventing dust, moisture, and other contaminants from affecting the circuitry.
Data Source
AI summary
An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.