Molded Interconnect Device Laser Direct Structuring
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Solution Overview
Problem
Existing semiconductor packages face challenges in downsizing while maintaining precision, particularly in molding lead frames, which is technically difficult due to the complexity of reducing size without compromising product precision.
Innovation Solution
A molded interconnect device is developed using laser beams to form a three-dimensional circuit with a lead portion connected to an external electrode by solder, where the lead main body is molded from the same resin material as the main body and coated with a metal film, allowing for simultaneous molding and plating processes to achieve high precision and reduced component count.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If lead frame is molded by insert molding to downsize semiconductor package, then device size is reduced, but manufacturing precision deteriorates
Solution Approach 1:
The patent merges the lead frame and semiconductor chip into a single integrated structure where the lead frame serves both as a structural support and as an electrical interconnect. This integration eliminates the need for separate molding processes for the lead frame, allowing the entire package to be molded as one piece, thereby maintaining precision while achieving downsizing.
Solution Approach 2:
The patent applies preliminary plating to the lead frame before molding, creating a precision-defined electrical connection path in advance. This preliminary action ensures that the electrical interconnect structure is established with high precision before the molding process, avoiding precision loss during subsequent manufacturing steps.
2Quantity of substance
If three-dimensional circuit is formed by laser beams, then component count is reduced, but device complexity increases
Solution Approach 1:
The patent transitions from planar two-dimensional circuit layouts to three-dimensional vertical interconnect structures. By utilizing the vertical dimension for electrical connections, the design integrates multiple circuit functions within a compact volume, reducing the number of discrete components while the laser-based fabrication provides precise control over the complex three-dimensional pathways.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the manufacturing of high-precision, downsized semiconductor packages with reduced assembly time and improved packaging density by forming the three-dimensional circuit and metal film through laser direct structuring and electroless plating, maintaining precision even at smaller sizes.
Implementation Method 1
A molded interconnect device according to one aspect of the present disclosure is adapted to form a three-dimensional circuit by using laser beams
Implementation Method 2
forming the three-dimensional circuit and metal film through laser direct structuring and electroless plating
Implementation Method 3
a lead portion connected to an external electrode of an external substrate by solder
Data Source
AI summary
A molded interconnect device adapted to form a three-dimensional circuit by using laser beams includes: a main body on which the three-dimensional circuit is formed; and a lead portion connected to an external electrode of an external substrate by solder and extending from the main body. The lead portion includes: a lead main body molded from a material same as a material of the main body; and a metal film formed on at least a part of an outer periphery of the lead main body.