Molded Proximity Sensor Packaging for Precise Optical Alignment
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Solution Overview
Problem
Conventional proximity sensor devices have high defect rates during fabrication due to precise placement requirements of tiny cap pieces and adhesive materials, leading to improper adhesion and aperture formation, which increases manufacturing costs.
Innovation Solution
The implementation of a proximity sensor device design that includes a printed circuit board substrate, a semiconductor die, electrical connectors, a lens, and an encapsulating layer, with the encapsulating layer covering the connectors, semiconductor die, and light emitting assembly to ensure proper alignment and adhesion, reducing the need for precise placement of cap pieces and adhesive materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If tiny cap pieces and adhesive materials are used to form apertures and secure components, then the proximity sensor can be fabricated with separate functional elements, but the fabrication defect rate increases due to precise placement requirements
Solution Approach 1:
The patent combines multiple separate components (cap pieces, adhesive materials, aperture formation) into a single integrated molded encapsulating layer. This merging eliminates the need for separate placement operations, reducing manufacturing complexity and defect rates while maintaining the functional separation of components through the molded structure's geometry.
Solution Approach 2:
The molding process performs multiple functions simultaneously in advance: it forms the encapsulating layer, creates apertures, positions components, and provides structural support all in one operation. This preliminary action prevents subsequent placement errors and reduces the need for precise manual or automated positioning of separate cap pieces and adhesives.
2Manufacturing precision
If cap pieces are precisely placed to form apertures over light emitting device and sensor area, then proper light path alignment is achieved, but fabrication time and cost increase
Solution Approach 1:
The patent merges aperture formation with the encapsulating layer molding process. The apertures are formed as integral features of the molded encapsulating layer rather than as separate components requiring precise placement. This simultaneously achieves proper light path alignment and dramatically improves fabrication efficiency by eliminating multiple sequential placement operations.
Solution Approach 2:
The patent changes the manufacturing parameter from separate component placement to integrated molding. By transitioning from a multi-step assembly process to a single-step molding process, the patent achieves both precise aperture alignment (through mold design) and improved productivity (through process consolidation).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces defect rates in proximity sensor fabrication by ensuring consistent and proper alignment of components, thereby lowering manufacturing costs and improving production efficiency.
Implementation Method 1
an encapsulating layer positioned on the first printed circuit board substrate, the plurality of electrical connectors, the semiconductor die, the first lens, and the light emitting assembly
Implementation Method 2
The first lens is positioned over the sensor area of the semiconductor die. The light emitting device emits light through the first aperture. The light emitted by the light emitting device that is reflected by an object in the vicinity of the proximity sensor may enter the second aperture, travel through the lens 116, and impact the sensor area 114
Data Source
AI summary
A proximity sensor includes a printed circuit board substrate, a semiconductor die, electrical connectors, a lens, a light emitting assembly, and an encapsulating layer. The semiconductor die is positioned over the printed circuit board substrate with its upper surface facing away from the printed circuit board substrate. Each of the electrical connectors is in electrical communication with a contact pad of the semiconductor die and a respective contact pad of the printed circuit board substrate. The lens is positioned over a sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads facing the printed circuit board substrate. The encapsulating layer is positioned on the printed circuit board substrate, at least one of the electrical connectors, the semiconductor die, the lens, and the light emitting assembly.