Molding Compound Wrapped Package Substrate Stiffening
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Solution Overview
Problem
The existing package substrates for high-density chip packages rely heavily on glass or ceramic interposers for stiffness, which is not suitable for thinner substrates as semiconductor technology advances, necessitating an alternative stiffening structure.
Innovation Solution
A molding compound is used to wrap the four lateral sides and bottom side of a thin film package substrate, providing stiffness and supporting redistribution circuitry with top and bottom metal pads, and solder balls for chip mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If glass or ceramic interposer is used to stiffen the package substrate, then the substrate has sufficient stiffness and structural support, but the substrate thickness increases and the structure becomes more complex
Solution Approach 1:
The patent removes the glass or ceramic interposer from the package substrate structure, extracting the problematic thick component while maintaining substrate stiffness through an alternative routing structure that distributes signals along the lateral sides of the substrate
Solution Approach 2:
The patent transitions from a vertical stacking approach (through-holed interposer) to a lateral routing approach, changing the dimensional orientation of signal paths from top-to-bottom to side-to-side, thereby reducing substrate thickness while maintaining functionality
2Strength
If glass or ceramic interposer is used to stiffen the package substrate, then the substrate has sufficient structural support, but the device complexity increases
Solution Approach 1:
The patent extracts and removes the complex glass or ceramic interposer component, simplifying the overall device structure by eliminating the need for through-holes, multiple layers, and complex assembly processes associated with interposers
Solution Approach 2:
The patent merges the routing function and stiffening function into a single integrated substrate structure, eliminating the need for separate interposer components and reducing overall device complexity
Data Source
AI summary
A package substrate for chip/chips package wrapped by a molding compound is disclosed. The molding compound functions as a stiffener for the thin film package substrate. One embodiment discloses at least one redistribution layer (RDL) is prepared and the RDL is wrapped by a molding compound. The molding compound wraps four lateral sides and bottom side of the RDL. A top side of the RDL is made for a chip to mount and a bottom side of the RDL is planted a plurality of solder balls so that the bottom side of the chip package is adaptive to mount onto a system board in a later process.