Molybdenum-Containing Copper Chromium Oxide Spinel for LDS Adhesion
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Solution Overview
Problem
Existing resin compositions containing metal oxides for laser direct structuring (LDS) face issues with particle shape and size control, leading to poor plating adhesion and uniform dispersion, resulting in metallic wiring peeling off from molded articles.
Innovation Solution
A copper chromium oxide spinel containing molybdenum is produced with controlled particle size and molybdenum distribution, achieved by using a molybdenum compound as a flux during the firing process, allowing for improved plating adsorption and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal oxides are used as additives for laser direct structuring, then plating formation is enabled, but metallic wiring peels off from molded articles due to insufficient particle shape and size control and weak bonding strength
Solution Approach 1:
The invention changes the particle size parameter to 0.5-5 μm and introduces molybdenum content (0.01-5 wt%) as a new parameter to control plating adhesion. This resolves the contradiction by establishing specific parameter ranges that simultaneously achieve good plating formation and prevent wiring peeling.
Solution Approach 2:
The invention creates a composite metal oxide containing Cu, Cr, and Mo elements with specific ratios. This composite structure provides both the necessary plating formation capability and improved bonding strength, resolving the contradiction between enabling plating and preventing peeling.
2Productivity
If metal oxides are used for laser direct structuring, then circuits can be formed, but the metal oxides are not uniformly dispersed in the resin
Solution Approach 1:
The invention optimizes particle size parameters (0.5-5 μm) and surface properties through molybdenum incorporation to improve dispersion uniformity. This allows the metal oxide to maintain high productivity while achieving stable uniform distribution in the resin matrix.
3Ease of manufacture
If chromium oxide and copper oxide are mixed and sintered, then copper-chromium black agent is produced, but the particles have reduced crystallinity and large particle size making them unsuitable for LDS
Solution Approach 1:
The invention changes the sintering temperature parameter to 800-950°C and introduces molybdenum oxide (0.01-5 wt%) as a controlling additive. This parameter optimization maintains the simplicity of the manufacturing process while achieving the required particle size (0.5-5 μm) and crystallinity for LDS applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The copper chromium oxide spinel with controlled particle size and molybdenum distribution enhances plating adhesion and uniform dispersion, improving the stability of metallic wiring in resin compositions for LDS applications.
Implementation Method 1
achieved by using a molybdenum compound as a flux during the firing process
Implementation Method 2
firing process
Implementation Method 3
when a laser is applied to a resin molded article containing a certain additive, and the surface of the part to which the laser has been applied is roughened and the additive is activated
Implementation Method 4
the surface of the part to which the laser has been applied is roughened
Implementation Method 5
molybdenum distribution
Data Source
AI summary
Provided is a copper chromium oxide spinel having a particle size used when made into a resin molded article and plating bonding properties, a resin composition of the same, a resin molded article, and a method for producing the copper chromium oxide spinel. Specifically, provided is a copper chromium oxide spinel containing molybdenum and having a D50 of 2.0 μm or less.