Monolithic 2D VCSEL Array for Solid-State LiDAR
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Solution Overview
Problem
Conventional solid state LIDAR systems using two-dimensional arrays of VCSELs face increased manufacturing complexity and cost due to wiring requirements, as well as inefficient use of space and VCSEL area when connecting one-dimensional arrays.
Innovation Solution
A monolithic two-dimensional VCSEL array is developed, where VCSELs are arranged in a matrix with metal contacts on both surfaces, allowing for electrical connection without the need for external wirings, enabling efficient space use and reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wirings are used to connect VCSELs in conventional arrays, then electrical connections can be established, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the electrical connection function directly into the VCSEL structure by forming metal contacts on the VCSEL chip surface. This integration eliminates the need for separate wirings to connect VCSELs in an array, thereby reducing manufacturing complexity while maintaining reliable electrical connections. The metal contacts are formed using standard semiconductor fabrication processes, making the connections both reliable and manufacturable.
Solution Approach 2:
The patent extracts the wiring function from the conventional array structure and replaces it with integrated metal contacts on each VCSEL. By removing the external wiring requirement and embedding the connection function within the VCSEL device itself, the manufacturing process is simplified while electrical connectivity is preserved.
2Reliability
If wirings are used to connect one-dimensional arrays of VCSELs, then electrical connections are achieved, but space efficiency and VCSEL area utilization decrease
Solution Approach 1:
The patent combines the electrical connection function with the VCSEL active area by forming metal contacts directly on the VCSEL chip surface within or adjacent to the active region. This integration eliminates the need for external wirings that would consume additional space, thereby maximizing VCSEL area utilization while maintaining reliable electrical connections for array configuration.
3Adaptability or versatility
If conventional VCSEL chip arrangements are used to form two-dimensional arrays, then array structure is achieved, but manufacturing cost and complexity increase
Solution Approach 1:
The patent merges the array configuration capability directly into the VCSEL chip structure by forming metal contacts that enable both row and column addressing. This integration allows two-dimensional arrays to be configured using standard semiconductor fabrication processes without requiring complex external wiring, thereby reducing manufacturing cost while maintaining full array configuration versatility.
Solution Approach 2:
The patent transitions from one-dimensional VCSEL chip arrangements to a two-dimensional monolithic structure by forming metal contacts on the VCSEL chip surface in specific patterns. This dimensional transformation enables direct formation of two-dimensional arrays without complex wiring, simplifying manufacturing while maintaining array configuration capability.
Data Source
AI summary
A two-dimensional VCSEL array may include a VCSEL array including a VCSELs arranged in a two dimensional matrix forming a monolithic structure, a light-emitting surface, and a rear surface, first metal contacts provided on the light-emitting surface; and second metal contacts provided on the rear surface. The VCSELs may be arranged in first lines in a first direction and second lines in a second direction non-parallel to the first direction. Each of the first metal contacts may be electrically connected to each VCSEL of a corresponding first line. Each of the plurality of second metal contacts may be electrically connected to each VCSEL of a corresponding second line. The first metal contacts and second metal contacts may be arranged such that each combination of a first metal contact and a second metal contact is electrically connected to one VSCEL.