Monolithically Integrated Coil Semiconductor Reducing Electromagnetic Interference
Solution Overview
Problem
Semiconductor components operated with coils face electromagnetic interference due to connection lines, requiring an improved solution for integration and handling.
Innovation Solution
A semiconductor component with a monolithically integrated coil, where the coil is mechanically joined to the semiconductor body and arranged in a trench, with windings that can be parallel or perpendicular to the surface, and optionally share a magnetic core to minimize interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the coil is mounted on a carrier and electrically connected to the semiconductor component, then electrical connectivity is achieved, but electromagnetic interference is caused by connection lines
Solution Approach 1:
The coil is monolithically integrated with the semiconductor component, merging two previously separate components into a single unified structure. The coil windings are formed directly on the semiconductor substrate using the same fabrication processes, eliminating the need for external mounting and connection lines, thereby resolving the electromagnetic interference issue while maintaining electrical connectivity
Solution Approach 2:
The connection lines that cause electromagnetic interference are completely removed from the system. The coil is electrically connected to the semiconductor component through integrated conductive structures formed during fabrication, extracting the harmful external connection elements while preserving the necessary electrical pathways
2Object-affected harmful factors
If the coil is monolithically integrated with the semiconductor body, then electromagnetic interference is reduced, but manufacturing complexity increases
Solution Approach 1:
The semiconductor fabrication process is made universal by using the same existing process steps (depositing conductive layers, forming patterns, etching) to create both the semiconductor device structures and the coil windings. This multi-functional approach allows the manufacturing process to produce both components simultaneously without requiring additional specialized manufacturing steps
Solution Approach 2:
The coil structure is segmented into multiple conductive layers that can be formed separately and then interconnected. The windings are created by depositing conductive material in specific patterns across different layers, allowing complex coil geometries to be built up systematically through modular fabrication steps that integrate seamlessly with standard semiconductor processes
Data Source
AI summary
One aspect of the invention relates to a semiconductor component with a semiconductor body with a top side and with a bottom side. A first coil that is monolithically integrated with the semiconductor body is arranged distant from the bottom side and comprises N first windings, wherein N≧1. The first coil has a first coil axis that extends in a direction different from a surface normal of the bottom side.