Monolithic LED Array with Integrated AC Circuit Structures
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Solution Overview
Problem
Existing light emitting diode (LED) devices require complex additional circuits to operate at normal voltages, complicating configuration and potentially undermining efficiency and reliability, and pose difficulties in miniaturization due to complicated circuit connections.
Innovation Solution
A monolithic light emitting diode array with a variety of circuit connection structures that can easily operate at alternating current (AC) voltage, featuring a light emitting stack with conductivity type semiconductor layers, insulating layers, conductive layers, and a substrate structure to facilitate efficient circuit connections between multiple LED cells.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If additional circuits (AC/DC converter) are added to enable LED operation at normal voltage, then the LED can operate at normal voltage, but the device complexity increases and efficiency/reliability deteriorates
Solution Approach 1:
The patent merges the LED chip array with circuit elements (resistors, capacitors, switches) into a single integrated structure where the circuit board substrate serves as both mechanical support and electrical connection medium. This integration eliminates the need for separate AC/DC converter circuits while enabling direct operation at normal voltage through the inherent circuit configuration.
Solution Approach 2:
The circuit board substrate performs multiple functions simultaneously: it provides mechanical support for the LED chips, establishes electrical connections between chips and external terminals, and implements the AC/LED voltage conversion through integrated passive components. This multi-functionality reduces overall device complexity while maintaining operational capability at normal voltage.
2Ease of operation
If additional circuits are added to enable LED operation at normal voltage, then the LED can operate at normal voltage, but efficiency and reliability deteriorate
Solution Approach 1:
The patent extracts the voltage conversion function from separate AC/DC converter circuits and implements it directly within the LED module through integrated resistors and capacitors. This extraction eliminates the need for additional external circuitry that would reduce reliability, while maintaining the capability to operate at normal voltage through the streamlined internal circuit configuration.
3Adaptability or versatility
If complicated circuit connections are used to enable AC operation, then the LED array can operate in response to AC voltage, but miniaturization becomes difficult
Solution Approach 1:
The patent nests circuit elements (resistors, capacitors, switches) and LED chips within a compact hierarchical structure on the circuit board substrate. The circuit elements are positioned in the spaces between LED chip arrays, and connections are routed through vertical vias and trace patterns that utilize three-dimensional space efficiently. This nesting approach enables full AC operation capability while maintaining a minimized overall array footprint.
Solution Approach 2:
The patent transitions from planar two-dimensional circuit layouts to three-dimensional spatial utilization by stacking LED chip arrays vertically and routing connections through multiple layers of the circuit board. This dimensional transition allows complex AC operation circuits to be integrated without proportionally increasing the array's planar footprint, thereby enabling miniaturization while maintaining AC adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the formation of complex circuit structures for AC operation, improving efficiency and reliability while simplifying the configuration and miniaturization of LED devices, allowing for easy connection of multiple LED cells in series or parallel.
Implementation Method 1
at least one light emitting stack including first and second conductivity type semiconductor layers and an active layer disposed therebetween
Implementation Method 2
a conductive layer connected to the second contact and extended along one of the side surfaces of the light emitting stack to have an extension portion adjacent to the first surface
Data Source
AI summary
A light emitting device including: at least one light emitting stack including first and second conductivity type semiconductor layers and an active layer disposed there between, the light emitting stack having first and second surfaces and side surfaces interposed between the first and second surfaces; first and second contacts formed on the first and second surface of the light emitting stack, respectively; a first insulating layer formed on the second surface and the side surfaces of the light emitting stack; a conductive layer connected to the second contact and extended along one of the side surfaces of the light emitting stack to have an extension portion adjacent to the first surface; and a substrate structure formed to surround the side surfaces and the second surface of the light emitting stack.