Monolithic MEMS Pressure and Inertial Sensor Integration via TSVs
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Solution Overview
Problem
The integration of discrete MEMS pressure and inertial sensors increases device footprint and requires complex electrical connections, leading to increased fabrication costs and complexity.
Innovation Solution
A multi-sensor system is developed where MEMS pressure and inertial sensors are monolithically integrated onto a single substrate, sharing fabrication processes and reducing the need for complex electrical connections by using Through Silicon Vias (TSVs) and a multilayer structure that includes a bonding layer and a second substrate for hermetic sealing and signal propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If discrete MEMS pressure sensor and inertial sensor are packaged separately, then each sensor can be optimized independently, but device footprint increases and electrical connection complexity increases
Solution Approach 1:
The patent combines discrete MEMS pressure sensor and inertial sensor into a single integrated device, merging two separate packaging processes into one unified structure. This integration maintains independent sensor optimization while reducing overall device footprint by eliminating separate housings and mounting requirements.
Solution Approach 2:
The integrated sensor device performs multiple functions (pressure sensing and inertial sensing) within a single package, allowing the device to serve multiple measurement purposes simultaneously. This multi-functionality approach reduces the need for multiple separate sensors while maintaining independent optimization capabilities for each sensing function.
2Manufacturing precision
If discrete MEMS pressure sensor and inertial sensor are packaged separately, then each sensor can be optimized independently, but electrical connection schemes become complex
Solution Approach 1:
The patent merges the electrical connection schemes of separate pressure and inertial sensors into a unified connection architecture. By integrating both sensors in one package, the device reduces the number of external connections required while maintaining independent sensor optimization through internal signal routing.
3Adaptability or versatility
If discrete MEMS pressure sensor and inertial sensor are packaged separately, then manufacturing flexibility is maintained, but fabrication costs increase
Solution Approach 1:
The patent combines two separate manufacturing processes into a single integrated fabrication workflow. By packaging both pressure and inertial sensors together, the device reduces fabrication costs associated with multiple discrete packaging operations while maintaining manufacturing flexibility through modular sensor design within the integrated package.
Data Source
AI summary
A method for forming a multi-sensor system includes forming an inertial sensor fixed electrode of an inertial sensor and a movable electrode of a pressure sensor on a first substrate having through silicon vias (TSVs). A second substrate is fusion bonded to a bonding layer on the first substrate. The second substrate and the bonding layer are patterned to form a transducer layer of the inertial sensor and a pressure sensor fixed electrode of the pressure sensor. The first substrate is etched to form a pressure sensor port aligned with the movable electrode.