Balanced electrode pairings average out gap width variations from uneven etching, reducing measurement bias in miniaturized sensors.
A micromechanical component uses an asymmetric seismic mass to detect translational and rotational deflections via capacitive sensors.
Bidirectional electrophoretic force replaces mechanical vibration to desorb particles from a probe, enabling stable capture in vacuum environments.
A physical quantity sensor uses a recessed hollow to position maximum tensile stress on a thin film section.
A motion measurement apparatus extracts kinematic physical quantities from three-axis velocity data to generate perceivable signals.
Gyroscope and accelerometer data estimate orientation changes, compensating for magnetometer inaccuracies caused by internal electromagnetic interference.
Opposing upper and lower vibration arms discriminate Coriolis vibrations from lateral acceleration interference.
A controller raises the set point temperature of an inertial instrument immediately after radiation exposure to stabilize thermal conditions.
A mobile terminal detects obstacles by comparing inertial measurements with time-of-flight distance data.
A physical quantity sensor uses protrusions positioned at specific distances to reduce bending stress on coupling portions.
A time domain switched gyroscope uses a digital trigger with a proximity switch to detect sense mass position.
Interleaved comb fingers in a single MEMS device detect in-plane and out-of-plane motion, reducing component count and power consumption.
Asymmetric through-holes reduce damping while electrode area compensation equalizes initial capacitances, eliminating adjustment processes.
Onboard sensors detect device orientation and motion to provide real-time deployment guidance, resolving trade-offs between reliability and manual precision.
Extends low-cost MEMS IMU range via blending and offset adjustment, eliminating factory calibration needs.
Dissymmetric comb configurations differentiate vertical and horizontal accelerations, reducing spurious signals in compact micro-machined devices.
Flexible sealing pad absorbs mechanical load to protect silicon pressure sensor chip from rigid encapsulation stress, eliminating complex oil-filled diaphragms.
Hinged beams support a proof mass in a fiber optic MEMS seismic sensor, enabling high-temperature operation beyond 75°C and improved frequency response.
A compact tube containing two fluids of different viscosities changes color upon impact to provide a visual indication.
A movable gate electrode contacts a gate insulating film to modulate channel current in a micro electro mechanical device.
Opposing sensor pairs with orthogonal axes cancel temperature gradient errors, improving measurement precision without adding system complexity.
Computation unit switches GPS module to sleep mode when acceleration sensor detects stationary state, reducing power consumption during tracking.
A monolithic multi-sensor system merges MEMS pressure and inertial sensors on a single substrate using through silicon vias for signal routing.
Atomic inertial sensors correct MEMS bias and scale factor drift using optical switching, resolving precision versus update rate contradictions.
A semiconductor pressure sensor positions a penetrating aperture edge inside a recess opening to separate stress fields.
AI classifies surface types using wearable force sensor data to improve movement estimation accuracy.
An elastic protective layer prevents cracking in a 100 μm piezoelectric element, maintaining responsiveness without a rigid substrate.
Asymmetric elastic members provide isotropic vibration restraint across all axes, eliminating rectification errors for accurate acceleration data.
A vibrating beam aligned at a 45-degree angle supports a weight member to detect Z-axis acceleration via resonant frequency changes.
Thermal accelerometer uses common mode temperature sensing to detect Z-axis acceleration alongside X and Y differential detection.
Detect surface charge via voltage differentials to prevent calibration drift caused by leakage currents in MEMS pressure sensors.
An insulating layer segments conductive portions in a MEMS gyroscope to enable independent voltage paths.
Extending the micromechanical structure over multiple functional layers increases design freedom and chip area efficiency for inertial sensors.
A piezoresistive resonator uses a folded spring lever to transmit mass motion to strain gauges while limiting gauge deformation.
A capacitive ring gyroscope uses a second harmonic to fundamental frequency amplitude ratio to generate primary drive signals.
Woven conductive threads act as capacitive sensors to detect pressure changes through capacitance variation between adjacent threads.
An unmanned aerial vehicle determines heading from inertial data when light levels fail to satisfy camera thresholds.
A watch shock indicator uses a deformable inertia block to detect acceleration.
Frame and S-shaped springs stabilize the mass bar, reducing cross-axis displacement that causes false airbag activation.
A head-up display system uses gyro sensor data to perform pitching correction on displayed objects.
Vertical beam torsional springs minimize quadrature error by suppressing unwanted resonance modes and reducing electrical noise in the sensing element.
Bended support members with specific curvature radii minimize thermal expansion stress on the detection element, improving sensitivity and reliability.
A method for producing acceleration sensors by welding pre-assembled sensor elements to internal housing supports.
Plasma-treated FDTS anti-stick layer prevents neighboring film adhesion, ensuring accurate inertia sensor measurements.
Internal torsion springs in a cutout region increase angular velocity sensitivity while reducing package stress susceptibility.
A three-layer chip-scale MEMS device integrates gyroscopes and accelerometers within bonded glass layers to create a compact inertial measurement unit.
Dual proof mass MEMS accelerometer uses parallel folded springs to decouple axis motion and minimize cross-axis sensitivity.
A physical quantity measuring apparatus adjusts an analog-to-digital converter reference voltage based on drive oscillation amplitude.
Segmented MEMS inertial sensor movable members with optimized center of gravity positioning prevent seesaw-swing collisions and stiction under strong vibration.