Monolithic Micro-LED Array Chip for High-Density Transfer
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Solution Overview
Problem
The challenge in manufacturing micro-LED displays lies in efficiently arranging and transferring a large number of micron-level light-emitting units onto a target substrate with high precision, as current methods face issues with alignment accuracy and epitaxy utilization due to the small size and spacing of these units.
Innovation Solution
A monolithic array chip design featuring a first semiconductor layer with multiple light-emitting units separated by trenches, allowing for high-density integration and reduced spacing between units, which improves epitaxy utilization and simplifies the transfer process by eliminating the need for extensive separation lanes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If micro-LEDs are arranged with small spacing to increase density, then the resolution and light-emitting area are improved, but the alignment accuracy and transfer precision deteriorate due to the small size of individual units
Solution Approach 1:
Multiple light-emitting units are merged into a single monolithic array chip structure, where several micro-LEDs are integrated on one semiconductor layer with shared electrodes and separation lanes, treating them as a unified transfer unit rather than individual components
Solution Approach 2:
The monolithic array chip is segmented into multiple light-emitting units separated by separation lanes, allowing the entire array to be transferred as one unit while maintaining individual unit boundaries for subsequent separation if needed
2Ease of manufacture
If traditional separation lanes are used between micro-LEDs, then the transfer process is simplified, but the area occupied by separation lanes increases, reducing the effective light-emitting area
Solution Approach 1:
The width of separation lanes is optimized to minimal necessary dimensions, and the configuration of separation lanes is adjusted to follow the contours of light-emitting units, reducing wasted space while maintaining transferability
Solution Approach 2:
The array structure utilizes two-dimensional arrangement optimization, where separation lanes are positioned strategically to allow complete array transfer while minimizing their area footprint through clever geometric configuration
3Productivity
If micro-LEDs are made smaller to increase display resolution, then the high-density packaging is improved, but the ease of mounting and defect replacement deteriorates
Solution Approach 1:
Multiple small micro-LEDs are combined into a single monolithic array chip that can be mounted as one unit, eliminating the need to handle and mount individual micron-level devices while maintaining high density
Solution Approach 2:
The array of micro-LEDs is pre-assembled and tested as a complete unit on the monolithic chip before transfer to the final substrate, allowing defect identification and replacement at the array level rather than individual device level
Data Source
AI summary
A monolithic array chip comprises a first semiconductor layer; a common electrode located on the first semiconductor layer; a first light-emitting unit with a first electrode located on the first semiconductor layer; a second light-emitting unit with a second electrode located on the first semiconductor layer; a third light-emitting unit with a third electrode located on the first semiconductor layer, wherein the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit are separated from each other by a trench.