Monolithic Pedestal Edge Ring for Arc-Free Film Deposition
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Solution Overview
Problem
Pedestals in substrate processing chambers often experience arcing issues during plasma-enhanced chemical vapor deposition, leading to non-uniform film deposition, edge ring damage, and operational inefficiencies.
Innovation Solution
A pedestal design with a monolithic edge ring integrated into the body, featuring a coated electrode and heaters, and a beveled edge ring to control capacitive discharge, along with a coating to increase volumetric electrical resistivity, reducing arcing and promoting uniform film deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate edge ring is used adjacent to the substrate, then the substrate can be supported and processed, but arcing occurs between the substrate and the edge ring leading to non-uniform film deposition and edge ring damage
Solution Approach 1:
The patent merges the edge ring and pedestal into a single monolithic structure, eliminating the interface between separate components that causes arcing. The integrated design ensures electrical continuity and eliminates capacitive discharge paths between the substrate support and edge ring, thereby preventing arcing and ensuring uniform film deposition across the substrate surface.
Solution Approach 2:
The patent introduces a coating layer on the electrode as an intermediary element that increases volumetric electrical resistivity. This coating acts as a mediator to reduce electrical discharge and arcing between the substrate and pedestal structure, thereby improving both reliability and film deposition uniformity by controlling capacitive discharge effects.
2Productivity
If traditional pedestal designs are used, then the structure is simple, but arcing causes operational problems including reduced throughput and lower die-per-substrate efficiency
Solution Approach 1:
The monolithic integration of the edge ring and pedestal reduces the number of separate components and assembly steps, simplifying the overall structure despite the advanced functionality. This integrated design eliminates the need for separate edge ring installation and maintenance, thereby improving throughput and die-per-substrate efficiency without significantly increasing structural complexity.
Solution Approach 2:
The patent employs composite material structures with coatings of different volumetric electrical resistivities applied to specific regions of the pedestal and electrode. This composite approach allows optimization of electrical properties to prevent arcing while maintaining structural integrity, thereby improving productivity without requiring overly complex device architecture.
3Reliability
If the edge ring is made from a single material, then manufacturing is easier, but the bevel geometry requires precise control to manage capacitive discharge
Solution Approach 1:
The patent applies local quality by introducing a coating with specific volumetric electrical resistivity properties on selected surfaces of the electrode, particularly on the beveled surfaces of the edge ring. This localized treatment allows precise control of capacitive discharge at critical interfaces while maintaining ease of manufacture for the base structure, as the coating can be applied after the bevel geometry is established.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes arcing, enhances film uniformity, increases throughput, and reduces operational costs by limiting plasma coupling and edge ring damage.
Implementation Method 1
The coating has a volumetric electrical resistivity that is greater than a volumetric electrical resistivity of the first electrode
Implementation Method 2
A processing method such as plasma-enhanced chemical vapor deposition (PECVD) can be used in such substrate processing chambers
Data Source
AI summary
Aspects of the present disclosure relate generally to pedestals, components thereof, and methods of using the same for substrate processing chambers. In one implementation, a pedestal for disposition in a substrate processing chamber includes a body. The body includes a support surface. The body also includes a stepped surface that protrudes upwards from the support surface. The stepped surface is disposed about the support surface to surround the support surface. The stepped surface defines an edge ring such that the edge ring is integrated with the pedestal to form the body that is monolithic. The pedestal also includes an electrode disposed in the body, and one or more heaters disposed in the body.