Monolithic Package Substrate Using Tested Functional Tiles
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Solution Overview
Problem
Advanced packaging in integrated circuits faces challenges due to contrasting requirements of different functions, such as high-speed I/O, die-to-die I/O, power delivery, and photonics, which result in lower yields and integration issues with traditional substrate processes.
Innovation Solution
Fabricate individual tiles with distinct functions using processes tailored to each function, test them separately, and integrate them into a monolithic substrate with redistribution layers, allowing for independent testing and improved yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional substrate processes are used to integrate all functions, then manufacturing simplicity is maintained, but yield decreases due to contrasting requirements of different functions
Solution Approach 1:
The substrate is divided into multiple independently fabricated tiles, each optimized for its specific function (high-speed I/O, die-to-die I/O, power delivery, photonics). These tiles are then integrated into the final substrate, allowing each function to be manufactured with its own optimal process while maintaining overall system integration.
Solution Approach 2:
Different regions of the final substrate (tiles) have different local qualities and process optimizations. For example, high-speed I/O tiles use thicker dielectric and metal layers, while die-to-die I/O tiles use thinner metal for smaller features. Each tile's manufacturing process is tailored to its specific functional requirements rather than using a uniform process across the entire substrate.
2Device complexity
If substrate size is increased to accommodate all functions, then integration is simplified, but yield decreases
Solution Approach 1:
Instead of manufacturing one large substrate, the system is segmented into multiple smaller tiles that are independently fabricated and then integrated. This segmentation allows each tile to be manufactured with higher yield while reducing the overall risk, as failures in one tile do not necessarily cause failure of the entire system.
Solution Approach 2:
Tiles are pre-fabricated and tested independently before final integration into the complete substrate. This preliminary action allows for early detection and replacement of defective tiles, ensuring that only functional tiles are integrated into the final product, thereby improving overall yield.
3Ease of manufacture
If uniform manufacturing processes are used for all functions, then process simplicity is maintained, but functional performance deteriorates due to contrasting requirements
Solution Approach 1:
Each tile is manufactured with local quality optimizations specific to its function. High-speed I/O tiles receive thicker dielectric and metal layers for signal integrity, while die-to-die I/O tiles receive thinner metal for smaller features and no via pads. Power delivery tiles receive thick metal for current carrying capacity. This localized optimization ensures each function achieves its required manufacturing precision.
Solution Approach 2:
Manufacturing parameters such as metal thickness, dielectric thickness, and feature size are changed according to the specific function of each tile. This allows each tile to be manufactured with parameters optimized for its functional requirements rather than using fixed uniform parameters across all tiles.
Data Source
AI summary
Each of a selected plurality of different facilities are fabricated into respective tiles, each tile being fabricated using processes best suited to the function of the facility. After tile testing, a selected set of good tiles is fabricated into a single, monolithic substrate in accordance with a selected layout. After substrate testing, the good substrate is then fabricated into a single advanced package.