Mountable Electronic Circuit Module Using External Electrodes
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Solution Overview
Problem
Conventional electronic circuit modules require complex wiring patterns and additional mounting electrodes, increasing manufacturing processes and costs, and can lead to unstable electrical characteristics due to parasitic inductance and noise issues.
Innovation Solution
A mountable electronic circuit module design where external connection electrodes on components function as module connection electrodes, eliminating the need for dedicated mounting electrodes and internal wiring patterns, allowing for direct connection to a separate circuit board and stabilizing the ground, thereby simplifying the structure and improving characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electronic circuit modules use separate mounting electrodes and internal wiring patterns to connect components, then electrical connections can be established, but the wiring electrode pattern becomes complicated, increasing manufacturing processes and cost
Solution Approach 1:
The patent merges the mounting electrode function with the connection electrode function by using the external connection electrodes of the first mountable electronic component as the module connection electrode. This eliminates the need for separate mounting electrodes and complex internal wiring patterns, directly resolving the contradiction between establishing electrical connections and reducing device complexity
Solution Approach 2:
The external connection electrode of the first mountable electronic component serves multiple functions: it acts as both the connection electrode for the component and the module connection electrode for mounting the entire module to the circuit board. This multi-functionality eliminates redundant structures and simplifies the overall module configuration
2Ease of manufacture
If conventional electronic circuit modules include separate mounting electrodes and wiring patterns, then module mounting is enabled, but the number of manufacturing processes increases
Solution Approach 1:
The patent combines the mounting function and electrical connection function into a single structure by using the external connection electrode as both the component connection electrode and the module mounting electrode. This reduces the number of separate manufacturing processes required, as no additional mounting electrode fabrication or complex wiring pattern creation is needed
Solution Approach 2:
The patent extracts and eliminates the redundant mounting electrode structure from the module design. By using the existing external connection electrode of the first mountable electronic component for mounting purposes, the design removes unnecessary manufacturing steps while maintaining the ability to mount the module to the circuit board
3Reliability
If conventional electronic circuit modules use complex wiring electrode patterns, then electrical connections are established, but cost increases
Solution Approach 1:
The patent merges the electrical connection function with the mounting function by using the external connection electrode for both purposes. This eliminates the need for separate mounting electrodes and complex internal wiring patterns, thereby reducing manufacturing cost while maintaining reliable electrical connections
Solution Approach 2:
The patent extracts and removes the costly complex wiring electrode pattern from the design by utilizing the external connection electrode of the first mountable electronic component as the module connection electrode. This simplification directly reduces manufacturing cost while preserving essential electrical connection functionality
4Reliability
If conventional electronic circuit modules use traditional wiring patterns, then components are connected, but parasitic inductance and noise issues arise
Solution Approach 1:
The patent extracts and eliminates the harmful internal wiring patterns from the module design by using the external connection electrode of the first mountable electronic component as the module connection electrode. This removes the source of parasitic inductance and noise while maintaining essential electrical connection functionality
Solution Approach 2:
Instead of using internal wiring patterns to connect components to a separate mounting electrode, the patent inverts the approach by using the external connection electrode of the first mountable electronic component directly as the module connection electrode. This reversal eliminates the harmful internal wiring path and reduces parasitic inductance and noise
Data Source
AI summary
A mountable electronic circuit module which produces appropriate characteristics without a complicated structure can be a DC-DC converter including a baseboard made of a magnetic material. A helical electrode is provided in the baseboard so as to function as a smoothing inductor device. Capacitor devices in addition to a DC-DC converter IC are mounted on a main surface of the baseboard. A circuit electrode arranged to connect the circuit devices is provided to enable the circuit devices to function as the DC-DC converter. The DC-DC converter is mounted on a motherboard through external connection electrodes of the capacitor devices.