Electronic Device Mounting Board With 3D Through-Cavity Heat Dissipation
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Solution Overview
Problem
Smaller electronic device mounting boards face challenges in providing sufficient heat dissipation due to their reduced size, leading to potential malfunctions and breakage from heat generated in components like sensing units and calculation units.
Innovation Solution
The electronic device mounting board features a substrate with continuous first and second through-cavities that form a three-dimensional flow channel, allowing for improved heat dissipation by increasing the flow channel's volume and directing heat away from non-heat-generating parts, which are formed from insulating layers such as ceramic materials or resins with metal layers for enhanced thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the electronic device mounting board is reduced in size, then the device becomes more compact, but the heat dissipation capability deteriorates
Solution Approach 1:
The patent transitions from two-dimensional planar flow channels to three-dimensional stacked through-cavities. Multiple first through-cavities in a first layer are combined with second through-cavities in a second layer to create vertical heat dissipation paths, effectively utilizing the Z-direction to increase heat dissipation capacity without increasing the board's footprint area.
Solution Approach 2:
The patent implements nested through-cavities where second through-cavities are positioned to overlap and connect with first through-cavities from the layer below. This nesting arrangement creates integrated three-dimensional flow channels that maximize heat dissipation within the limited vertical space of the mounting board structure.
2Volume of stationary object
If the flow channel volume is increased, then heat dissipation is improved, but the device complexity increases
Solution Approach 1:
The patent divides the flow channel into segmented first through-cavities and second through-cavities located in different layers. This segmentation allows the complex three-dimensional heat dissipation function to be broken down into simpler, manufacturable components that can be formed using standard PCB drilling and etching processes, reducing overall manufacturing complexity.
Solution Approach 2:
The patent merges multiple first through-cavities with second through-cavities to form integrated three-dimensional flow channels. By combining these cavities across layers, the patent achieves increased flow channel volume and heat dissipation capability while maintaining a unified structural design that simplifies manufacturing compared to creating entirely new complex structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively enhances heat dissipation in smaller electronic device mounting boards, reducing the risk of malfunctions and breakage by providing a wider flow channel and efficiently transferring heat away from heat-generating components.
Implementation Method 1
a flow channel for improving heat dissipation
Implementation Method 2
metal layers for enhanced thermal conductivity
Data Source
AI summary
An electronic device is mountable on a substrate. The substrate includes a first layer and a second layer located on a lower surface of the first layer. The first layer includes a plurality of first through-cavities. The second layer includes at least one second through-cavity overlapping the plurality of first through-cavities in a plan view. The plurality of first through-cavities are continuous with the at least one second through-cavity.