Electronic Component Mounting Position Correction via Solder Recognition Marks
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Solution Overview
Problem
Existing electronic component mounting systems face challenges in achieving uniform bonding quality due to varying self-alignment effects based on electrode shape, component size, mass, and solder characteristics, leading to potential bonding failures when using uniform position correction methods.
Innovation Solution
An electronic component mounting system that employs a printing apparatus to create recognition marks on a board, allowing for specific mounting modes based on recognition results of these marks to correct positional deviations, enabling precise placement of components according to their characteristics without requiring solder inspection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If uniform position correction method is applied to all electronic components, then the mounting process is simplified, but bonding quality varies and bonding failures occur for certain component types
Solution Approach 1:
The patent segments the mounting process into two distinct modes: first mounting mode for components that benefit from self-alignment effect (using solder printing position as reference) and second mounting mode for components that do not (using electrode position as reference). This segmentation allows different correction strategies to be applied to different component types, resolving the contradiction between process simplicity and bonding quality consistency.
Solution Approach 2:
The patent introduces dynamic selection of mounting modes based on component characteristics. The system automatically determines whether to apply first mounting mode or second mounting mode correction based on the specific component type, electrode shape, and expected self-alignment effect strength. This dynamic adaptation enables the system to optimize bonding quality for each component while maintaining overall process efficiency.
2Manufacturing precision
If self-alignment effect is utilized for all components, then mounting precision is improved for small components, but large-mass components cannot be properly aligned and may rotate
Solution Approach 1:
The patent divides components into two categories based on their response to self-alignment effect: small components that can be properly aligned using the effect, and large-mass components that cannot. The first mounting mode is applied to small components to utilize self-alignment for improved precision, while the second mounting mode is applied to large components to prevent rotation and ensure proper alignment, thus resolving the contradiction between precision improvement and adaptability.
Solution Approach 2:
The patent applies different correction qualities to different component types. For small components, the system applies precise correction based on solder printing position that leverages self-alignment effect. For large components, the system applies correction based on electrode position that prevents unwanted rotation. This local differentiation of correction quality ensures optimal results for each component type.
3Manufacturing precision
If solder inspection is implemented to determine correction method, then mounting quality is improved, but process complexity and time increase
Solution Approach 1:
The patent performs preliminary classification of components into those that benefit from self-alignment effect and those that do not, before the actual mounting process. This preliminary action allows the system to pre-determine the appropriate mounting mode for each component, eliminating the need for real-time solder inspection to make correction method decisions. The result is improved mounting quality without the added complexity and time of implementing solder inspection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures proper mounting position correction for each electronic component, enhancing bonding quality by tailoring the mounting process to the component's characteristics, thereby reducing the risk of bonding failures and improving the overall quality of the mounted board.
Implementation Method 1
a position correcting technique in which solder position information acquired by measuring solder printing positions actually is fed forward to a post-process
Data Source
AI summary
An electronic component mounting system includes: a printing apparatus; an electronic component mounting apparatus; and a mounting information storage unit which stores mounting information. The mounting information includes execution mode information in which one of a first mounting mode and a second mounting mode is set for each of electronic components. In the first mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a first recognition mark formed on a board. In the second mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a second recognition mark formed by paste printed on the board. The electronic components are mounted on the board according to mounting modes set for the respective electronic components by referring to the mounting information.