Mounting Stage Groove Isolation for Edge Ring Discharge
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Solution Overview
Problem
Existing substrate processing apparatuses experience discharge issues in supply holes that supply heat media for heat exchange with edge rings, leading to unstable electrostatic attraction and non-uniform processing temperatures, which affect etching uniformity.
Innovation Solution
A mounting stage design that includes an electrostatic chuck and an edge ring with supply holes for heat medium, where a groove is provided on either the edge ring or mounting stage but not in communication with the supply holes, preventing abnormal discharge and maintaining constant electrostatic attraction force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If supply holes are provided for heat medium circulation, then heat exchange efficiency is improved, but discharge occurs in the supply holes causing electrostatic attraction instability
Solution Approach 1:
The harmful groove that causes discharge is extracted and removed from the structure. The patent specifically eliminates grooves in the edge ring that would be in communication with supply holes, thereby removing the source of discharge while maintaining the supply hole functionality for heat exchange.
Solution Approach 2:
The patent applies different structural qualities to different regions: supply holes are provided in specific locations for heat exchange, while grooves are deliberately excluded from regions that would communicate with these supply holes. This localized differentiation prevents discharge while maintaining thermal efficiency.
2Temperature
If grooves are provided for heat medium flow, then heat distribution is improved, but discharge occurs leading to non-uniform processing temperature
Solution Approach 1:
The patent converts the potential harm of grooves (which cause discharge) into a benefit by strategically positioning them. Grooves are provided in regions that do not communicate with supply holes, allowing heat medium flow improvement without triggering discharge. The harmful effect is eliminated while retaining the beneficial heat distribution.
3Force
If supply holes are used for heat medium, then electrostatic attraction is maintained, but discharge causes attraction force fluctuation
Solution Approach 1:
The patent introduces a structural intermediary solution: supply holes are provided to maintain electrostatic attraction, but grooves are excluded from communication paths with these holes. This intermediary structural arrangement prevents direct discharge paths while allowing the supply holes to function, thereby maintaining stable electrostatic attraction force.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration suppresses abnormal discharge, maintains uniform electrostatic attraction, and ensures consistent processing temperatures, thereby achieving stable and uniform etching processes.
Implementation Method 1
an electrostatic chuck configured to attract the substrate
Implementation Method 2
supply holes through which a heat medium is supplied to a space between the electrostatic chuck and the edge ring
Data Source
AI summary
Provided is a mounting stage on which a substrate to be subjected to a plasma process is mounted. The mounting stage includes: an electrostatic chuck configured to attract the substrate and an edge ring disposed around the substrate; and supply holes through which a heat medium is supplied to a space between the electrostatic chuck and the edge ring. A groove is provided in at least one of the edge ring and the mounting stage, and the groove is not in communication with the supply holes.