Electronic Mounting Substrate Channel Layout for Wire Short Prevention
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Solution Overview
Problem
The challenge is to prevent short circuits and malfunctions in electronic devices due to the bending of fine wires and dust accumulation caused by air injection/discharge processes in electronic element mounting substrates, especially with the increasing fineness of electronic element terminals and the potential deterioration of bonding strength between wires and electrode pads.
Innovation Solution
The electronic element mounting substrate design includes a channel that extends through the frame body in a position not overlapping with the connection conductors, with electrode pads located above or below the channel, reducing air impingement on wires and dust accumulation near the electrodes, thereby minimizing the risk of short circuits and improving bonding strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If air injection/discharge is performed through the channel to replace air inside the electronic device, then the air replacement function is achieved, but the fine wires may bend and cause short circuits between adjacent wires
Solution Approach 1:
The patent positions the channel opening on the side surface of the substrate rather than on the top surface, changing the spatial dimension of air injection. This side-opening configuration directs air flow away from the wire region, preventing wire bending and short circuits while maintaining effective air replacement functionality
2Reliability
If the channel inner wall height is positioned at or near the electrode height to enable air discharge, then air discharge function is achieved, but dust may enter from the channel and cause short circuits between electrodes
Solution Approach 1:
The patent extracts the channel opening from the top surface area near the electrodes and relocates it to the side surface. This separation removes the source of dust entry away from the electrode region, preventing dust-induced short circuits while preserving the air discharge function
3Reliability
If the channel is positioned to allow air injection/discharge, then air flow function is achieved, but the bonding strength between wires and electrode pads may deteriorate due to air pressure
Solution Approach 1:
The patent applies local quality by positioning the channel opening in a specific location on the side surface that is spatially separated from the wire bonding regions. This localized positioning allows air flow to occur without directly impinging on the wire-electrode pad bonding areas, thereby maintaining bonding strength while preserving air injection/discharge functionality
Data Source
AI summary
An electronic element mounting substrate includes a substrate including, on a first upper surface, a mounting region in which an electronic element is mounted, a frame body located on the first upper surface of the substrate and surrounding the mounting region, a channel extending through the frame body outward from an inner wall of the frame body, and an electrode pad located on the first upper surface of the substrate or an inner surface of the frame body. The channel is located above or below the electrode pad.