Mounting Substrate Imaging with Dual Lighting for Light-Emitting Alignment
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Solution Overview
Problem
Existing methods for manufacturing mounting boards with light emitting components, such as LEDs, fail to accurately position the light emitting portions on the board, despite accurately positioning the outer shape and electrode, leading to a need for improved precision in component mounting.
Innovation Solution
A component mounter system with dual lighting units and cameras is employed to accurately determine and correct the position of light emitting portions by imaging components from multiple angles, using first and second lighting conditions to capture outer shape and feature portion positions, and applying correction values to ensure precise mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If only outer shape and electrode positioning is performed, then manufacturing process is simple, but light emitting portion positioning accuracy is insufficient
Solution Approach 1:
The positioning system is segmented into multiple independent measurement modules: outer shape positioning, electrode positioning, and light emitting portion positioning. Each module uses specific imaging units and lighting conditions to measure distinct features, allowing accurate light emitting portion positioning without requiring a completely complex unified system.
Solution Approach 2:
Different lighting conditions are applied locally to highlight specific features: first lighting conditions for outer shape and electrode visualization, second lighting conditions for light emitting portion visualization. This localized quality enhancement allows each feature to be measured with optimal clarity without requiring the entire system to be overly complex.
2Measurement precision
If multiple imaging units and lighting conditions are used, then light emitting portion positioning accuracy is improved, but device complexity increases
Solution Approach 1:
The imaging unit serves multiple functions by working with different lighting conditions: first lighting conditions enable outer shape and electrode imaging, second lighting conditions enable light emitting portion imaging. This multi-functionality allows a single camera to perform all positioning measurements, reducing device complexity compared to having separate dedicated cameras for each feature.
Solution Approach 2:
The system uses periodic switching between first and second lighting conditions to capture different features sequentially. This periodic action allows the same imaging unit to measure multiple features at different time steps, avoiding the need for simultaneous multi-camera systems and reducing overall device complexity.
3Manufacturing precision
If correction values are calculated and applied, then mounting position accuracy is improved, but measurement and calculation time increases
Solution Approach 1:
Positional relationships between outer shape, electrode, and light emitting portion are measured and stored in advance as reference data. When actual mounting is required, pre-established correction values and positional relationships are applied, avoiding time-consuming real-time calculations and achieving both high accuracy and efficient positioning.
Data Source
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AI summary
A method for manufacturing a mounting board includes a first outer shape position acquisition step, a feature portion position acquisition step, a calculation step, a holding step, a second outer shape position acquisition step, and a mounting step. In the first outer shape position acquisition step, a first outer shape position of a component is acquired. In the feature portion position acquisition step, a position of a feature portion is acquired. In the calculation step, a deviation amount of the position of the feature portion with respect to the first outer shape position is calculated. In the second outer shape position acquisition step, a second outer shape position of the component is acquired. In the mounting step, the feature portion of the component is mounted to be positioned on a target position of a board based on the second outer shape position and the deviation amount.