Movable Cooling Member for Rapid Process Chamber Thermal Control
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Solution Overview
Problem
Conventional substrate processing apparatuses take a long time to cool the inside of a process chamber, which can lead to inefficiencies and temperature control issues during semiconductor device manufacturing.
Innovation Solution
A substrate processing apparatus with a heating element surrounded by an inner and outer wall, featuring a cooling member that can be moved between contacting and non-contacting positions with these walls using an actuating mechanism, allowing for rapid cooling of the process chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional heater unit with reflectors is used to heat the process chamber, then heating function is achieved, but cooling time becomes excessively long
Solution Approach 1:
The cooling member is designed to be movable between a first position where it contacts the inner wall for cooling, and a second position where it does not contact the inner wall. This dynamic positioning allows the system to switch between heating and cooling modes efficiently, resolving the contradiction by enabling rapid cooling without compromising the heating function.
Solution Approach 2:
The heating device is segmented into distinct functional components: a heater unit for heating, and a separate movable cooling member for cooling. This segmentation allows each component to perform its function independently and optimally, with the cooling member being introduced only when cooling is needed, thus reducing overall cooling time.
2Temperature
If the cooling member is always in contact with the inner wall, then cooling efficiency is maximized, but temperature control flexibility is reduced
Solution Approach 1:
The cooling member's movable design allows it to dynamically adjust its position based on process requirements. It can contact the inner wall when rapid cooling is needed, or move away when heating or temperature maintenance is required, thus providing both high cooling efficiency and temperature control flexibility.
Solution Approach 2:
The system changes the positional parameter of the cooling member to control thermal conditions. By moving the cooling member between contact and non-contact positions, the system can rapidly change thermal parameters to meet different processing requirements, achieving both efficient cooling and flexible temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid cooling of the process chamber, improving temperature control and reducing temperature overshoot, thus enhancing the efficiency and uniformity of semiconductor device processing.
Implementation Method 1
a cooling member (60) disposed in a space between the inner wall (34) and the outer wall (35)... wherein the cooling member is in contact with at least one of the inner wall (34) and the outer wall (35) at the contacting position
Data Source
AI summary
Provided are a substrate processing apparatus, a heating device, and a semiconductor device manufacturing method. The substrate processing apparatus comprises a process chamber configured to process a substrate. A heating element is installed at a peripheral side of the process chamber. An annular inner wall is installed at a peripheral side of the heating element. An annular outer wall is installed at a peripheral side of the inner wall with a space being formed therebetween. An annular cooling member is installed at the space for cooling. An actuating mechanism moves the cooling member between a contacting position where the cooling member makes contact with at least one of the inner wall and the outer wall and a non-contacting position where the cooling member does not make contact with any one of the inner wall and the outer wall. A control unit controls at least the actuating mechanism.