Movable Heater Distance Control for Rapid Substrate Temperature Adjustment
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in quickly adjusting the temperature of treatment liquids during processing, particularly when switching between high and low temperature treatments, leading to prolonged processing times due to the need for temperature stabilization of both the substrate and treatment liquid.
Innovation Solution
A substrate processing apparatus with a rotation mechanism, a nozzle for supplying treatment liquid, a heater for heating the substrate and treatment liquid, and a movement mechanism that allows the heater to adjust its distance from the substrate, enabling quick temperature adjustments of the treatment liquid by changing the heat transfer distance rather than the heating temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heater temperature is changed to adjust the treatment liquid temperature, then the treatment liquid temperature can be adjusted, but the temperature adjustment is slow and processing time is prolonged
Solution Approach 1:
The invention changes the control parameter from heater temperature to heater-to-substrate distance. By moving the heater closer to or farther from the substrate, the treatment liquid temperature is adjusted rapidly without the time delay associated with heating element thermal response. This parameter substitution resolves the contradiction between temperature adjustability and processing time.
Solution Approach 2:
The invention introduces a movable heater mechanism that dynamically adjusts the distance between the heater and substrate during processing. This dynamic positioning allows rapid temperature transitions by simply changing the spatial relationship rather than waiting for thermal equilibrium, thereby reducing processing time while maintaining temperature control capability.
2Stability of the object's composition
If the substrate temperature is maintained constant to keep the treatment liquid temperature stable, then the treatment liquid temperature is maintained, but switching between high and low temperature treatments requires processing interruption
Solution Approach 1:
The movable heater enables dynamic temperature switching by adjusting its distance from the substrate. During high-temperature treatment, the heater is positioned close to the substrate; for low-temperature treatment, it is moved away. This dynamic adjustment allows seamless transition between treatment temperatures without interrupting the processing sequence, thereby maintaining both temperature stability and processing efficiency.
Solution Approach 2:
The invention changes the control approach from maintaining constant substrate temperature to controlling heater-to-substrate distance. This parameter substitution allows the substrate temperature to vary naturally with heater position while the treatment liquid temperature remains controllable, eliminating the need to interrupt processing when switching between high and low temperature treatments.
3Power
If the heater is positioned close to the substrate for efficient heating, then heating efficiency is improved, but the substrate temperature becomes difficult to control during treatment
Solution Approach 1:
The movable heater mechanism allows dynamic adjustment of the heater-to-substrate distance. By positioning the heater close to the substrate during heating phases and moving it away during treatment phases, the system achieves both high heating efficiency and precise temperature control. The temporal separation of heating and treatment functions resolves the contradiction between heating power and temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for rapid temperature adjustments of the treatment liquid during substrate processing, reducing processing time and enabling seamless transitions between high and low temperature treatments without interrupting the processing sequence.
Implementation Method 1
a heater configured to heat the substrate supported by the support at a distance from the substrate
Implementation Method 2
heating the substrate and the treatment liquid on the surface of the substrate by the heater
Implementation Method 3
rotate a substrate horizontally and supply a treatment liquid to a surface of the substrate from a nozzle facing near the center of the surface so that the treatment liquid is spread over the surface due to the centrifugal force of the rotation
Data Source
AI summary
According to one embodiment, a substrate processing apparatus (1) includes: a support (4) configured to support a substrate (W); a rotation mechanism (5) configured to rotate the support (4) about an axis that crosses the substrate (W) supported by the support (4) as a rotation axis; a nozzle (6) configured to supply a treatment liquid to a surface of the substrate (W) on the support (4) being rotated by the rotation mechanism (5); a heater (8) configured to heat the substrate (W) supported by the support (4) at a distance from the substrate (W); and a movement mechanism (9) configured to move the heater (8) in directions toward and away from the substrate (W) supported by the support (4).