Movable Partition Gas Distribution for Wafer Uniformity

Solution Overview

Problem

Conventional processing apparatuses have limited flexibility and compatibility with changing processing conditions or next-generation devices, as they require manual adjustment or replacement of components to achieve desired surface uniformity on processing targets like semiconductor wafers.

Innovation Solution

A processing apparatus with a processing gas distribution unit that includes partitioned spaces and valves within the processing gas discharge unit, allowing for dynamic adjustment of processing gas supply amounts and types based on position on the wafer surface without manual intervention, enabling flexible positioning of gas discharge without altering the circular ring-shaped partition wall or processing gas discharge unit.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a fixed circular ring-shaped partition wall is used to control gas discharge positions, then process uniformity can be optimized for specific conditions, but adaptability to changing processes or next-generation devices deteriorates

Engineering Contradiction:

Improveprocess uniformityVSAvoidcompatibility with changing processes

Core Design Contradiction:

Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The partition wall is designed to be movable rather than fixed, allowing its position to be adjusted dynamically. The partition wall can be moved along the processing gas discharge unit to change the discharge positions for central and edge portions of the wafer, enabling adaptation to different process conditions without replacing the entire discharge unit.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The processing gas discharge unit is segmented into multiple independent spaces (first space for central portion, second space for edge portion, and third space as intermediate) that can be independently controlled. This segmentation allows flexible adjustment of gas discharge characteristics for different wafer regions to achieve desired process uniformity.

Inventive Principle:

Principle #1Segmentation

2Manufacturing precision

If manual adjustment or replacement of the circular ring-shaped partition wall is performed to change gas discharge positions, then process uniformity can be optimized, but operation complexity and time consumption increase

Engineering Contradiction:

Improvesurface uniformityVSAvoidadjustment complexity

Core Design Contradiction:

Manufacturing precisionVSEase of operation

Solution Approach 1:

The partition wall is designed to be movable rather than fixed, allowing its position to be adjusted dynamically. The partition wall can be moved along the processing gas discharge unit to change the discharge positions for central and edge portions of the wafer, enabling adaptation to different process conditions without replacing the entire discharge unit.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system enables self-adjustment of gas discharge positions through automated control of the movable partition wall, reducing the need for manual intervention. The processing gas distribution unit can automatically adjust the partition wall position based on process requirements, minimizing operator involvement and reducing adjustment time.

Inventive Principle:

Principle #25Self-service

3Manufacturing precision

If the entire processing gas discharge unit is replaced to achieve new gas discharge positions, then process uniformity can be optimized, but device complexity and cost increase

Engineering Contradiction:

Improveprocess uniformityVSAvoidreplacement requirements

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The partition wall is designed to be movable rather than fixed, allowing its position to be adjusted dynamically. The partition wall can be moved along the processing gas discharge unit to change the discharge positions for central and edge portions of the wafer, enabling adaptation to different process conditions without replacing the entire discharge unit.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The processing gas discharge unit is designed with multi-functionality to handle various process conditions. By incorporating a movable partition wall that can be positioned at different locations, a single discharge unit can serve multiple process requirements, eliminating the need for multiple specialized discharge units or frequent replacements.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS10665431B2Processing method

Publication Date: 2020.05.26 TOKYO ELECTRON LTD

AI summary

A method for performing a process on a target in a chamber. A gas discharge unit includes a first space having a discharge hole for discharging a first gas, a second space having a discharge hole for discharging a second gas and a third space having a discharge hole for discharging a gas generated between the first and second spaces. A distribution unit includes a first distribution pipe communicating with the first space, a second distribution pipe communicating with the second space and a third distribution pipe communicating with the third space. A valve group includes a first valve opened or closed to the first distribution pipe and a second valve opened or closed to the second distribution pipe. The method includes switching, without mixing the first gas and the second gas, the gas discharged from the discharge hole in the third space by opening or closing the valve group.