Movable Pin Array for Uniform Baking of LCD Substrates
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Solution Overview
Problem
The liquid crystal display panel manufacturing process faces issues with uneven heating during the pre-baking of polyimide films, leading to brightness inconsistencies and other defects due to varying film shrinkage rates caused by temperature irregularities.
Innovation Solution
A controlled baking method and device that utilize a set of pins to support and move a substrate in a predetermined pattern, alternating between two preset distances and directions to ensure consistent heating, preventing repeated or prolonged contact at the same location, thus maintaining uniform heating across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the pins are heated to contact the glass substrate for pre-baking, then the PI film can be formed on the substrate, but uneven heating occurs causing brightness inconsistency and traces in the LCD display panel
Solution Approach 1:
The pin array is made movable rather than stationary, allowing it to change position dynamically during the heating process. The pin array can move in multiple directions and adjust its contact points with the substrate, ensuring that no single location receives excessive heat while maintaining consistent overall heating across the entire substrate surface.
Solution Approach 2:
The pin array performs periodic contact with the substrate by moving away and returning to contact positions in cycles. This periodic action allows heat to distribute evenly across different areas of the substrate over time, preventing localized overheating while ensuring complete coverage for uniform film formation.
2Ease of operation
If the pins remain in fixed positions during heating, then the heating process is simple to control, but the same locations receive prolonged heat causing uneven temperature distribution
Solution Approach 1:
The pin array transitions from a static configuration to a dynamic one, capable of moving in multiple directions. This dynamic positioning system maintains operational simplicity through automated control while achieving temperature uniformity by continuously varying the contact locations, ensuring each area of the substrate receives appropriate heat exposure.
3Productivity
If the pins contact the substrate continuously at the same locations, then the heating process is efficient and quick, but it causes localized overheating and film shrinkage inconsistency
Solution Approach 1:
The pin array implements periodic contact with the substrate by cycling between contact and non-contact states while moving to different positions. This maintains heating efficiency through continuous processing while preventing localized overheating by distributing heat exposure across multiple locations over time, ensuring consistent film shrinkage and quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively addresses the issue of uneven heating, ensuring consistent film formation and preventing brightness inconsistencies in liquid crystal display panels by maintaining consistent heating across the substrate.
Implementation Method 1
The pre-baking may be achieved by heating the pins to alternatively contact the glass substrate
Data Source
AI summary
The present application is applicable to the field of material making, and there is provided a baking method, device and baking oven including: acquiring a predetermined instruction, and starting timing and cycling the following steps: controlling a first set of pins to support a substrate from an initial position and recording the rising times of the first set of pins; raising the first set of pins to a first preset position, and controlling the first set of pins to move a first preset distance in a first preset direction, wherein the first preset distance is associated with the rising times of the first set of pins; controlling the lowering of the first set of pins such that a second set of pins supports the substrate; and controlling the first set of pins to return to the initial position, when the first set of pins drops to a second preset position.