Pretreated Surfaces TRIZ Cases

A high molecular weight acrylate protective layer acts as a diffusion barrier for photopolymer substrates.

Continuous saturation of textile structures with molten lactam resolves incomplete fiber wetting caused by high polymer melt viscosity.

A modified polyamic acid composite film enhances dielectric constant through polyvinylidene fluoride blending.

A cross-linkable primer material forms a protective network on semiconductor substrates through chemical bonding.

A film forming apparatus uses segmented gas flow paths to manage carrier, source, and purge gases independently.

Angled recoater vanes redirect vertical powder flow laterally, resolving uneven coating and excessive consumption in additive manufacturing.

Incorporating 1,1-di-activated vinyl compounds enables multi-cure mechanisms that lower curing temperatures while maintaining abrasion resistance.

A liquid ionic material deposits a protective film on semiconductor substrates to maintain surface purity during atmospheric transfer.

Mechanical buffing of chrome-plated steel golf club shafts establishes micro-roughness that enables strong primer adhesion for wear-resistant decorative layers.

A micro patch coating device forms two-phase fluids to create precise patterns on substrates.

Dipping semi-sintered zirconia-alumina ceramic in neodymium solution achieves homogeneous white coloring while maintaining mechanical strength.

Temperature and pH adjustments trigger viscosity increases after application, preventing inter-layer mixing while maintaining high-speed coating efficiency.

Layered fusion bonding of crystalline glass plates and small masses overcomes confined crystal growth to produce dynamic, natural-marble-like patterns.

Irregular abrasive trajectories conceal clear coat repairs, eliminating visible patterns while maintaining high throughput.

Plasma treatment and hydrophilic primer extend durability on PDMS biochips, preventing non-specific adsorption while maintaining flexibility.

Automated UV curing applies transparent polymer to glass edges, resolving labor intensity and optical clarity trade-offs.

Dual-initiator photopolymerization creates a composite hard coat layer that suppresses substrate curling while maintaining scratch resistance.

Segmented hanging drying system applies controlled temperatures to web substrates, resolving uneven water removal in thick adhesive layers.

Bioabsorbable polymeric coatings shield in-vivo sensors from sterilization damage, then desorb at predetermined times to restore analyte detection capability.

A capacitive touch screen panel uses a half-tone mask to form connection patterns and routing wires in a single step.

Carboxy-functional polyether binders stabilize aqueous basecoats against pinholes by managing solvent escape during curing.

A benzophenone-acrylate copolymer forms a non-silicone, non-fluorine release coating that maintains high residual adhesive force.

Cutting coating through seam regions enables continuous patterns across seams while allowing fabric separation for installation.

Curing a cyclic olefin-based resin composition prevents molecular orientation, reducing in-plane retardation while maintaining thermal stability.

Electron beam irradiation treats resin vessels at atmospheric pressure, merging coating and sterilization to eliminate vacuum cycle delays.

Replacing hazardous solvents with water eliminates DMF removal steps and side reactions while maintaining high-temperature thermal protection.

An internal light source cures adhesive and resin layers on a roll mold, eliminating multiple etching steps that cause dimensional variations.

Adding organic ionic compounds increases conductivity to counterbalance electrostatic forces and improve template filling speed.

Acetoacyl polymer coatings eliminate formaldehyde emissions by replacing acid-catalyzed crosslinking with amine-functional agents.

Sequential electroless plating deposits conductive materials on work pieces by applying reducing agent and metal source solutions separately.

Thermally conductive plating moves heat from the apex region while a borided layer maintains hardness, preventing metal softening.

Sequential black oxide and phosphate coatings deliver deep black color, scratch resistance, and corrosion protection for low and high silicon steels.

A porous aluminum electrode formation method using ammonium adipate and boric acid solutions to build high-capacitance layers.

Positive pressure from inert gas prevents film oxidation during cold spray deposition, eliminating complex vacuum systems.

Aggregates and coalesces resin particles to create uniform powders, eliminating irregular shapes from pulverization.

Amino group polysiloxane intermediate layer traps sodium ions migrating from silicone rubber, preventing interfacial peeling of the fluororesin surface layer.

A thermally curable film-forming composition maintains initial complex viscosity during flash off and baking to ensure optimal sag control.

Covalently bonded PDMS polymers prevent lubricant loss, maintaining liquid repellency under harsh conditions without topography damage.

A two-part polymer mixture fills apertures in metal card cores, resolving delamination risks while enabling contactless payment module integration.

Dynamic pin positioning prevents localized overheating and film shrinkage inconsistencies by distributing heat evenly across the substrate.

Sequential wet-on-wet application with specialized binders enables single-cycle curing, improving chip resistance while reducing environmental impact.

Heating the substrate during dip-coating accelerates curing and solvent evaporation, reducing glare without expensive vacuum equipment.

A polyacrylic acid adhesive matrix crosslinked with pentaerythritol and divinyl glycol forms a cohesive sealant using non-aqueous solvents.

Modified epichlorohydrin rubber suppresses ionic migration to stabilize electrical resistance and prevent contamination.

Flat conductive particles in the electrode coating reduce impedance while preventing tissue adhesion during surgical procedures.

Plasma irradiation of metal compound cured film improves dry etching resistance without degrading filling property on complex substrates.

Ultrasonic atomization replaces mechanical needles to eliminate droplet contamination while maintaining high vacuum purity during thin film deposition.