Magnetic Shielding Package Structure for MRAM Interference Protection
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Solution Overview
Problem
Semiconductor chips, particularly magnetic random access memory (MRAM) chips, are susceptible to malfunction due to external magnetic interference, which existing packaging materials and methods fail to adequately mitigate.
Innovation Solution
A magnetic shielding structure surrounding the integrated circuit package, comprising a top and bottom plate made of magnetic materials with optional pillars, redirects external magnetic flux to reduce interference on sensitive semiconductor chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If magnetic shielding structure is added to protect MRAM chip from external magnetic interference, then reliability is improved, but device complexity increases
Solution Approach 1:
The magnetic shielding structure is integrated within the packaging structure itself, with top and bottom plates positioned on opposite sides of the semiconductor chip. The shielding plates are nested within the packaging housing, creating a protective magnetic shield without requiring separate external components. This nesting approach improves reliability by blocking external magnetic fields while avoiding the complexity of adding separate shielding systems.
2Object-affected harmful factors
If packaging structure is expanded to include magnetic shielding plates, then object-affected harmful factors are reduced, but volume of stationary object increases
Solution Approach 1:
Magnetic shielding plates are positioned specifically on the top and bottom sides of the semiconductor chip where external magnetic interference most directly affects the device. Rather than providing uniform shielding in all directions, the plates are strategically placed at the critical locations where magnetic field protection is most needed. This localized approach reduces magnetic interference effectively while minimizing the overall volume increase of the packaging structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The magnetic shielding structure effectively minimizes magnetic interference, ensuring the functionality and reliability of magnetic-sensitive semiconductor chips by redirecting external magnetic fields away from the chip.
Implementation Method 1
A magnetic shielding structure surrounding the integrated circuit package, comprising a top and bottom plate made of magnetic materials with optional pillars, redirects external magnetic flux to reduce interference on sensitive semiconductor chips
Data Source
AI summary
A package structure includes an integrated circuit package and a magnetic shielding structure. The integrated circuit package includes a semiconductor chip. The magnetic shielding structure surrounds the integrated circuit package, in which the magnetic shielding structure including a top plate and a bottom plate disposed on two opposite sides of the integrated circuit package.