Multi-Antenna Chip Packaging Structure for Shorter RF Paths
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Solution Overview
Problem
Current antenna packages for 5G communication and automotive radar chips are large in size, have long signal transmission paths, and high signal loss, complicating the manufacturing process.
Innovation Solution
A packaging method involving multiple layers of antenna and chip integration using a single carrier substrate, including an adhesion layer, protective layer, antenna layers, conductive pillars, dielectric layers, and redistribution layers, with conductive bumps for electrical connections, reducing package size and signal loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple modules (antenna, filter, amplifier, RF transceiver) are assembled on a PCB using a carrier substrate, then the system achieves complete wireless functionality, but the package size becomes large and the signal transmission path becomes long
Solution Approach 1:
The patent combines multiple previously separate modules (antenna, filter, amplifier, RF transceiver) into a single integrated package structure. The antenna is directly mounted on the PCB substrate, and other components are positioned adjacent to it on the same substrate, eliminating the need for separate carrier substrates and reducing overall package volume while maintaining complete wireless functionality.
Solution Approach 2:
The patent transitions from a three-dimensional stacked arrangement (using multiple carrier substrates vertically) to a planar two-dimensional arrangement on a single PCB substrate. This dimensional change allows all components to be positioned in the same plane, reducing the vertical height and overall package size while maintaining all necessary connections and functionalities.
2Adaptability or versatility
If multiple modules are assembled on a PCB using a carrier substrate, then the system achieves complete wireless functionality, but the signal transmission path becomes long and signal loss increases
Solution Approach 1:
By merging all wireless functionality modules onto a single PCB substrate with direct mounting, the patent minimizes the distance between components. The antenna is directly connected to the RF transceiver and other components through short trace connections on the same substrate, dramatically reducing signal transmission path length and associated losses compared to previous multi-substrate assemblies.
3Adaptability or versatility
If multiple carrier substrates are used for assembling multiple modules, then complete wireless functionality is achieved, but the manufacturing process becomes complicated
Solution Approach 1:
The patent merges all module assembly operations onto a single PCB substrate, eliminating the need for multiple carrier substrates. This consolidation simplifies the manufacturing process by reducing the number of assembly steps, eliminating the need for multiple substrate alignment and bonding operations, and allowing all components to be mounted and interconnected in a single integrated structure.
Data Source
AI summary
A packaging structure comprising a first antenna layer on a protective layer, a dielectric layer, a first plastic packaging layer over the first antenna layer, a second conductive pillar, a chip, a redistribution layer, and a second plastic packaging layer, the first conductive pillar is electrically connected to the first antenna layer, the dielectric layer is formed over the first conductive pillar, the second antenna layer is electrically connected to the first conductive pillar, the second conductive pillar is formed over the dielectric layer and electrically connected to the second antenna layer, the chip layer is formed over the dielectric layer, the redistribution layer is provided with conductive bumps and electrically connected to the chip and the second antenna layer, and the second plastic packaging layer encapsulates the second antenna layer and the chip. Chip and multiple antennas are packaged with one carrier substrate, reducing size.