Multi-Bond Head Component Packaging for Simultaneous Die Processing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional flip chip assembly apparatuses have limited productivity due to sequential operation and inability to handle multiple types of wafers or dies simultaneously, leading to complex and unreliable production lines.
Innovation Solution
A component packaging apparatus with multiple bond heads and a pick-up platform that allows simultaneous picking and dipping of multiple components, along with independently operated transfer devices for processing different components on the same substrate, enhancing productivity and handling complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single bond head is used to pick up and bond dies sequentially, then the device structure is simple, but the productivity is limited because dies are processed one by one
Solution Approach 1:
The patent combines multiple bond heads (at least two) into a single component transfer device, allowing simultaneous pickup and bonding of multiple dies. This merging of multiple bonding functions into one device increases productivity without requiring separate standalone bonding devices for each die.
Solution Approach 2:
The component transfer device with multiple bond heads serves multiple functions: it can handle different types of dies, perform pickup, transfer, and bonding operations simultaneously, and accommodate various wafer types. This multi-functionality resolves the contradiction by enabling high productivity within a single versatile device rather than requiring multiple specialized devices.
2Adaptability or versatility
If multiple conventional devices are combined to handle multiple types of dies, then the ability to handle different die types is improved, but the production line becomes very large and complex with unreliable operation
Solution Approach 1:
The patent merges the functionality of multiple conventional devices into a single component transfer device with multiple bond heads. This unified device can handle different types of dies simultaneously, eliminating the need for separate devices for each die type and thereby reducing production line complexity while maintaining versatility.
Solution Approach 2:
The component transfer device is designed with universal capability to handle multiple types of dies and wafers through its multiple bond heads and configurable structure. This multi-functional design allows one device to replace multiple specialized devices, resolving the contradiction between adaptability and device complexity.
3Productivity
If dies are picked up and dipped into flux one by one, then the flux receptacle design is simple, but the work cycle cannot be overlapped and productivity is limited
Solution Approach 1:
The patent combines multiple bond heads with coordinated flux dipping capability, allowing multiple dies to be dipped into flux simultaneously or in overlapping cycles. This merging of multiple dipping functions enables work cycle overlap and significantly increases productivity compared to sequential dipping.
Data Source
AI summary
A component packaging apparatus includes: at least one component supply device; at least one component processing device, which is configured to process components provided by the component supply device; at least one component transfer device, each component transfer device respectively having multiple bond heads, each bond head transferring one of the said components which are processed by the component processing device; wherein the component processing device comprises a pick-up platform, which is configured to simultaneously arrange the multiple components, and the multiple bond heads are configured to pick up the multiple components simultaneously from the pick-up platform at one time. A method for packaging components is also provided.